This is the last blog of our mini-series which discusses the frequently asked questions for the 3800 Die Bonder, 8000i Wire Bonder, and the ...

Posted by Katie Finney on July 21

This is the last blog of our mini-series which discusses the frequently asked questions for the 3800 Die Bonder, 8000i Wire Bonder, and the ...

Posted by Katie Finney on June 30

Palomar/Hughes started designing and manufacturing wedge bonders in the early 1980s for the aerospace and defense industries. Later, these ...

Posted by Katie Finney on May 12

Carlsbad, CA – April 20, 2015 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging ...

Posted by Katie Finney on April 21

An advanced packaging capital equipment supplier’s technical prowess grows by providing successful solutions to customers over many years. ...

Posted by Katie Finney on April 7

Strategies in Light Over 7,000 people attended the Strategies in Light conference again this year at the Sands Convention Center and Expo ...

Posted by Katie Finney on March 10

[For the English version, click here.] 本月初，Palomar Technologies 宣布推出其第7代楔形键合机：型号为9000的全自动细线楔形键合机。Palomar ...

Posted by Katie Finney on February 3

[For the English version, click here.] Palomar Technologies, Entreprise de pointe dans le secteur des machines d’assemblage de systèmes ...

Posted by Katie Finney on January 27

Last week, Palomar Technologies announced the launch of its 7th wedge bonder: the 9000 Fine Wire Wedge Bonder. Palomar/Hughes started ...

Posted by Katie Finney on January 13

For many years, wire bonding has been the most robust and commonly used method for chip-to-die interconnection of lead-frame, integrated ...

Posted by Janine Powell on June 24