This is the second blog of the Frequently Asked Questions mini-series. This mini-series discusses the frequently asked questions for the ...

Posted by Katie Finney on June 16

[For the English version, click here.] En termes d’interconnexion de premier niveau, quelle pourrait être la meilleure situation possible? ...

Posted by Katie Finney on June 2

Handlers are bonder options that can bring great value and efficiency to your assembly process. The 8000i Wire Bonder is a fully automated ...

Posted by Katie Finney on April 14

An advanced packaging capital equipment supplier’s technical prowess grows by providing successful solutions to customers over many years. ...

Posted by Katie Finney on April 7

There has been a recent upsurge in photonic packages used for fiber-optic communication. Fiber-optics has several distinct advantages over ...

Posted by Katie Finney on March 31

Strategies in Light Over 7,000 people attended the Strategies in Light conference again this year at the Sands Convention Center and Expo ...

Posted by Katie Finney on March 10

In terms of first-level interconnects, what is the absolute best possible condition? The answer would be mid-span wire breaks during ...

Posted by Janine Powell on December 9

[For the English version, click here.] 超过5000人参加了最近战略光技术的15周年会议，超过200家公司展出- 包括了Palomar Technologies ...

Posted by Janine Powell on September 9

Thank you for visiting us at SEMICON West 2014 in San Francisco. It was a complete success! Over 26,000 people attended SEMICON West and ...

Posted by Katie Finney on July 15

For many years, wire bonding has been the most robust and commonly used method for chip-to-die interconnection of lead-frame, integrated ...

Posted by Janine Powell on June 24