Over the years, microelectronic wire bond process and packaging engineers have debated whether to use ball or wedge bond technologies. This ...

Posted by Palomar Technologies MarCom Team on November 4

Our opening graphic contains three illustrations. Moving from left to right, these are respectively those of a stream engine, a nuclear ...

Posted by Palomar Technologies MarCom Team on October 21

In part three of our series on Packaging Technologies meet Quantum Opportunities, we present an overview of how KETS Quantum Security, Bay ...

Posted by Palomar Technologies MarCom Team on September 29

One of the great shifts currently taking place in global defense sensor technologies, is due to a fundamental realignment of military ...

Posted by Palomar Technologies MarCom Team on June 1

A traditional means to justify the expense of purchasing new bonding equipment is to calculate the units per hour (UPH) of the proposed ...

Posted by Palomar Technologies MarCom Team on May 17

In Part two of our series on Packaging Technologies meet Quantum Opportunities, Palomar’s Dr. Anthony O’Sullivan interviews Dr. Andrew ...

Posted by Palomar Technologies MarCom Team on April 26

In the early part of 2021, global analysts McKinsey & Company published a number of articles noting that the COVID crisis has led, ...

Posted by Palomar Technologies MarCom Team on April 12

Much of the semiconductor packaging industry is engaged with an exciting and growing photonics ecosystem. Anticipating seven percent CAGR ...

Posted by Palomar Technologies MarCom Team on March 15

Auxiliary wires are commonly defined as an additional wire outside of a normal ball-to-stitch wire bond. Whether it be a pre-wire, ...

Posted by Palomar Technologies MarCom Team on March 1

As we reflect on the events of 2020 and anticipate their unfolding in 2021, our vision sharpens to reveal a clear trifecta of forces ...

Posted by Palomar Technologies MarCom Team on January 4