Back-end manufacturing in micro-optoelectronics, though representing only ~10% of the total investment to bring a product to market, is a ...
Posted by Palomar Technologies MarCom Team on
In what is the third and final article our “turmoil series”, we focus on the potentially radical impact of changes taking place within the ...
Posted by Palomar Technologies MarCom Team on
The market for the IR sensing devices has been growing steadily, but in recent years, the market experienced a rapid growth. Several ...
Posted by Palomar Technologies MarCom Team on
This is Part 3 of a 3-part blog series on Logistic Sensor Packaging. For more information, read Part 1 and Part 2. For device ...
Posted by Palomar Technologies MarCom Team on
This is part 2 of a 3-part blog series on Logistic Sensor Packaging. For more information, read Part 1. As a technical discipline, robotics ...
Posted by Palomar Technologies MarCom Team on
The next few years hold out sensor opportunities concomitant to the spectacular growth in global robotics. One of the key drivers for the ...
Posted by Palomar Technologies MarCom Team on
When it comes to the die bonding process for the assembly of RF power transistors, the most important metric is good thermal management. ...
Posted by Palomar Technologies MarCom Team on
One of the great shifts currently taking place in global defense sensor technologies, is due to a fundamental realignment of military ...
Posted by Palomar Technologies MarCom Team on
A traditional means to justify the expense of purchasing new bonding equipment is to calculate the units per hour (UPH) of the proposed ...
Posted by Palomar Technologies MarCom Team on
In Part two of our series on Packaging Technologies meet Quantum Opportunities, Palomar’s Dr. Anthony O’Sullivan interviews Dr. Andrew ...
Posted by Palomar Technologies MarCom Team on
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