[For the English version, click here.] Es ist unumstritten – überall wo automatische Drahtbonder eingesetzt werden, wird ständig versucht ...

Posted by Janine Powell on August 27

Today’s mainstream electronics manufacturing consists mainly of semiconductor packages and surface mount technology processes. Together, ...

Posted by Janine Powell on August 20

SEMICON West is the flagship annual event for the global microelectronics industry. It is the premier event for the display of new products ...

Posted by Janine Powell on August 13

It is safe to say that any organization utilizing an automated wire bonder continually strives to increase productivity and efficiency. ...

Posted by Janine Powell on July 30

Flip chip processes have been around for more than 40 years. Since then, thousands of applications have taken advantage of the size and ...

Posted by Janine Powell on July 23

[For the English version, click here.] Soldagem de fio de bola de ouro Ouro (Au) ainda é o método predominante para interconexões em ...

Posted by Janine Powell on July 16

Near-sourcing, out-sourcing, in-sourcing, crowd-sourcing, group-sourcing—which one is right for your organization? Palomar Technologies' ...

Posted by Janine Powell on July 2

SEMICON West 2013 is barely two weeks away; attendees are just days away from over 50 hours of technical programs and focused access to ...

Posted by Janine Powell on June 25

Handlers are bonder options that can bring great value and efficiency to your assembly process. For example, on the 8000 Wire Bonder, ...

Posted by Janine Powell on June 18

“IMS is THE place to be for high reliability packaging!” was the IMS Insider tweet from Palomar Technologies—and a very true statement ...

Posted by Janine Powell on June 11