Handlers are bonder options that can bring great value and efficiency to your assembly process. For example, on the 8000 Wire Bonder, ...

Posted by Janine Powell on June 18

“IMS is THE place to be for high reliability packaging!” was the IMS Insider tweet from Palomar Technologies—and a very true statement ...

Posted by Janine Powell on June 11

[For English, click here.] 为了提高第二焊接点的可靠性，传统上是在第二个焊接点上焊上一个球(security bond)。虽然这种方法确实创造一个更可靠的焊线，它同时也导致产量的下降。这方法只能使用正向的焊线动作。 ...

Posted by Palomar Technologies MarCom Team on June 4

According to a recent Business Insider report, there are over 1.5 billion people in the world today using a smartphone, so it is safe to ...

Posted by Janine Powell on May 21

Just as routine medical exams and checkups can help us live longer and healthier lives, routine checkups of bonders can extend the life of ...

Posted by Janine Powell on May 14

[For the English version, click here.] Gold (Au) Ball- Drahtbonden ist immer noch die beherrschende Verbindungsmethode in der ...

Posted by Janine Powell on May 7

Multi-Chip Module packaging is an important facet of modern electronic miniaturization and micro-electronic systems. Demand for further ...

Posted by Janine Powell on April 30

The increasingly densely populated and higher power levels of RF & Optoelectronic packages are creating unique challenges for assembly ...

Posted by Janine Powell on April 23

Gold (Au) ball wire bonding is still the predominate method for interconnects in microelectronics. Industries are further utilizing novel ...

Posted by Janine Powell on April 16

Today’s microelectronic manufacturing environments seem to be constantly changing. One day you are building up traditional “flat-land” ...

Posted by Janine Powell on April 9