Flexible Wire Bonding in Complex Hybrid Markets
Today’s microelectronic manufacturing environments seem to be constantly changing. One day you are building up traditional “flat-land” ...
Posted by Janine Powell on
Today’s microelectronic manufacturing environments seem to be constantly changing. One day you are building up traditional “flat-land” ...
Posted by Janine Powell on
With the creeping rise in the price of gold, many microelectronics manufacturing companies have been looking for alternatives to reduce the ...
Posted by Janine Powell on
Throughout the history of electronics manufacturing, there have been distinct boundaries between those that assemble SMT components and ...
Posted by Palomar Technologies MarCom Team on
Mobile electronic products continually require finer geometries for packaged integrated circuits. Wireless phones, PDA and digital cameras ...
Posted by Palomar Technologies MarCom Team on
Productronica is the world’s leading international trade fair for innovative electronics production. The 2011 show—held at a large modern ...
Posted by Palomar Technologies MarCom Team on
The SEMICON West 2011 show floor has been buzzing with confidence and optimism for the microelectronic packaging industry. “SEMICON West is ...
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One frequently asked question when addressing high-power wire bonding applications is “how many wires do I need?” As a common ...
Posted by Palomar Technologies MarCom Team on
Continuing on with our overview of microelectronic interconnection methods, we will discuss three additional methods: Solder Bump Bonding, ...
Posted by Palomar Technologies MarCom Team on
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