PTI Blog

Bonder Software: Improving Yield

Advanced Packaging Software is arguably where a die or wire bonder is enabled to stretch and accomplish some extraordinary application ...

Posted by Palomar Technologies MarCom Team on

Semicon West 2010 - Preview

July 13th - The DAY We are now only days away from Semicon West 2010, which opens at 10 AM on Tuesday, July 13th at the Moscone Center in ...

Posted by Palomar Technologies MarCom Team on

TAB Bonding and Other Bonding Methods

Quick note: "Other" in the suject is referring to wire bonding and die attach, and the sub-sets that come with them, ie epoxy, eutectic, ...

Posted by Palomar Technologies MarCom Team on

Automation & Expertise in Contract Assembly

Taking from our last post, we determined that the playing field of contract assembly in complex microelectronics, in regards to cost has ...

Posted by Palomar Technologies MarCom Team on

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