Celebrate 43 years of SEMICON West

SEMICON West is the flagship annual event for the global microelectronics industry. It is the premier event for the display of new products and technologies for microelectronics design and manufacturing, featuring technologies from across the microelectronics supply chain, from electronic design automation, to device fabrication (wafer processing), to final manufacturing (assembly, packaging, and test). More than semiconductors, SEMICON West is also a showcase for emerging markets and technologies born from the microelectronics industry, including micro-electromechanical systems (MEMS), photovoltaics (PV), flexible electronics and displays, nano-electronics, solid state lighting (LEDs), and related technologies.

SEMICON West 2013 was a milestone for Palomar Technologies. Conference attendees were among the first in the world to see live demos of the new 8000i Wire Bonder with Intelligent Interactive Graphical Interface™: (i2Gi™) and VisionPilot™ on the 3800 Die Bonder! These dynamic and intuitive technologies support enhanced control, performance and increased throughput for automated wire bonding and die attach production. Even more exciting is the availability of these technologies for existing Palomar equipment via a Bonder Performance Upgrade (BPU), a cost-effective way to bring existing bonders up to the latest technology offerings.

Watch the SEMICON West 2013 Recap Video

Technical Resources

8000i Wire Bonder 
Data Sheet 

8000i wire bonder, ball bumper, i2Gi

 

VisionPilot Data Sheet

VisionPilot Data Sheet 

 

i2Gi Data Sheet 

i2Gi, intelligent interactive graphical interface, modern wire bond control software


3800 Die Bonder Data Sheet

 3800 Die Bonder Data Sheet

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Jessica Sylvester
Marketing Communications Manager
Palomar Technologies, Inc.