As microelectronics device designs evolve, so must handling and assembly processes. Die sorting is used to separate die of one wafer into ...

Posted by Janine Powell on October 8

Hughes Aircraft is one of America’s great iconic companies and arguably the pioneer of the avionics, aerospace and defense industry we know ...

Posted by Janine Powell on October 1

Today’s mainstream electronics manufacturing consists mainly of semiconductor packages and surface mount technology processes. Together, ...

Posted by Janine Powell on August 20

SEMICON West is the flagship annual event for the global microelectronics industry. It is the premier event for the display of new products ...

Posted by Janine Powell on August 13

Flip chip processes have been around for more than 40 years. Since then, thousands of applications have taken advantage of the size and ...

Posted by Janine Powell on July 23

The increasingly densely populated and higher power levels of RF & Optoelectronic packages are creating unique challenges for assembly ...

Posted by Janine Powell on April 23

Cost and availability of spare parts are of considerate interest to anyone who currently owns a piece of capital equipment or anyone ...

Posted by Palomar Technologies MarCom Team on January 29

It's hard to believe we're already well into the new year. Echoing the happy new year well wishes from our CEO, the entire Palomar ...

Posted by Palomar Technologies MarCom Team on January 8

There are a myriad of differences between eutectic or epoxy die attach methods. There are some obvious trade-offs and benefits to both, ...

Posted by Palomar Technologies MarCom Team on December 18

IMAPS 2012 delivered another great conference covering a wide array of topics. Held this year in San Diego, hundreds of industry peers, ...

Posted by Palomar Technologies MarCom Team on September 18