W – Wafer While the microelectronics industry is working hard to develop low-cost LED packaging methods—such as with thermally and ...

Posted by Janine Powell on January 22

[For the English version, click here.] Традиционно, ультразвуковая микросварка предполагает разварку перемычек с кристалла на подложку. ...

Posted by Janine Powell on January 21

U – Uniformity We are seeing more and more innovation in form factor and functionality in solid-state lighting products as lighting ...

Posted by Janine Powell on January 15

Returning to our series on everything LEDs, we will pick back up at letters “S” and “T” with substrates and thermal/temperature sensitive. ...

Posted by Janine Powell on January 8

Introduction to the Series With so much important technological history tied to Hughes Aircraft, it’s hard to believe that more has not ...

Posted by Janine Powell on January 7

When discussing the hot topic of LEDs, quality and reliability become two major factors. Without either of these qualities, LEDs would have ...

Posted by Janine Powell on December 18

Although there is continued effort in the semiconductor packaging industry to reduce package size along with the never-ending pursuit of ...

Posted by Janine Powell on December 17

O – Optics The purpose of an optical component is to manipulate light. Typically, when we think of LED optics, what comes to mind is a ...

Posted by Janine Powell on December 11

When we think of microelectronics manufacturing, we usually think about manual equipment, semi-automatic equipment, and fully automatic ...

Posted by Janine Powell on December 10

M – Metal-Organic Chemical Vapor Deposition (MOCVD) MOCVD is a process used to grow an epitaxial layer of GaN. Pits often appear during the ...

Posted by Janine Powell on December 4