Cleaning, Surface Modification, and Etching Process Plasma cleaning is defined as a process that uses an ionized gas to interact with a ...

Posted by Janine Powell on May 20

There has been a resurgent growth in the fiber communications industry over the last few years. Much of this is to support higher bandwidth ...

Posted by Janine Powell on May 13

As frequencies go up in traditional hybrid and optoelectronic packaging, the first level wire interconnect itself can become a problem. The ...

Posted by Janine Powell on May 6

This second installment of the history overview of the Hughes Aircraft Industrial Products Division series will cover developments of ...

Posted by Janine Powell on April 22

Wire bond interconnects have traditionally been considered "forward" bonded wires. Forward bonding refers to bonding from an integrated ...

Posted by Janine Powell on April 15

[For the English version, click here.] Il y a des myriades de différences entre la soudure eutectique ou le collage à l’époxy . Il existe ...

Posted by Janine Powell on April 8

Today’s multipurpose wire bonding machines are required to deliver a combination of wires, bumps, and specialty interconnects for RF, ...

Posted by Janine Powell on April 1

The importance of automobile maintenance and tune-up is analogous to wire and die bonder maintenance. Proper maintenance and tuning of your ...

Posted by Janine Powell on March 25

[For the English version, click here.] 虽然虽半导体封装行业继续不断努力，设法缩小产品的体积以及永无止境的追求成本的节约,但是仍然有相当数量的应用程序需要一套完全不同的贴片和键合功能。 ...

Posted by Janine Powell on March 11

Last week was the 15th anniversary of the Strategies in Light technical conference. Over 5,000 people attended the conference, and more ...

Posted by Janine Powell on March 4