Thank you for visiting us at SEMICON West 2014 in San Francisco. It was a complete success! Over 26,000 people attended SEMICON West and ...

Posted by Katie Finney on July 15

[For the English version, click here.] Cela nous est tous arrivez un jour : Votre micro-câbleuse fonctionne parfaitement et la production ...

Posted by Janine Powell on July 8

For many years, wire bonding has been the most robust and commonly used method for chip-to-die interconnection of lead-frame, integrated ...

Posted by Janine Powell on June 24

Palomar recently exhibited at two very high tech shows in Florida: Electronics Component and Technology Conference (ECTC) and the ...

Posted by Janine Powell on June 17

Assistance with a bonder should not begin and end with its purchase. Such complex, sophisticated machinery requires support from experts ...

Posted by Janine Powell on June 10

[For the English version, click here.] 随着传统的混合和光电子封装频率上升，导致基本的键合工艺产生问题。主要的问题是反应性电感的产生。除此之外，反应性电容也是一个问题。但是，导线的形状从圆形改为扁带形就能直接影响反应性电感这个最关键问题。 ...

Posted by Janine Powell on June 3

Cleaning, Surface Modification, and Etching Process Plasma cleaning is defined as a process that uses an ionized gas to interact with a ...

Posted by Janine Powell on May 20

There has been a resurgent growth in the fiber communications industry over the last few years. Much of this is to support higher bandwidth ...

Posted by Janine Powell on May 13

As frequencies go up in traditional hybrid and optoelectronic packaging, the first level wire interconnect itself can become a problem. The ...

Posted by Janine Powell on May 6

This second installment of the history overview of the Hughes Aircraft Industrial Products Division series will cover developments of ...

Posted by Janine Powell on April 22