Often when companies are discussing potential projects, they are at a crossroads on the most economical way to proceed with a small ...

Posted by Janine Powell on February 18

Though the trend is moving away from gold wire for high-volume production wire bonding, gold ball wire bonding still makes up about 50 ...

Posted by Janine Powell on February 11

Much has been written about using Design of Experiments to optimize the input parameters to an automatic wire bonder in order identify the ...

Posted by Janine Powell on February 5

Y – Yield In order for LED manufacturers to stay competitive in this dynamic environment, they need to have a comprehensive in-line process ...

Posted by Janine Powell on January 29

Eutectic bonding of Au-backed MMIC (Monolithic Microwave Integrated Circuits) power amplifiers presents a unique challenge due to the thin, ...

Posted by Janine Powell on January 28

W – Wafer While the microelectronics industry is working hard to develop low-cost LED packaging methods—such as with thermally and ...

Posted by Janine Powell on January 22

[For the English version, click here.] Традиционно, ультразвуковая микросварка предполагает разварку перемычек с кристалла на подложку. ...

Posted by Janine Powell on January 21

U – Uniformity We are seeing more and more innovation in form factor and functionality in solid-state lighting products as lighting ...

Posted by Janine Powell on January 15

Returning to our series on everything LEDs, we will pick back up at letters “S” and “T” with substrates and thermal/temperature sensitive. ...

Posted by Janine Powell on January 8

Introduction to the Series With so much important technological history tied to Hughes Aircraft, it’s hard to believe that more has not ...

Posted by Janine Powell on January 7