First Level Interconnects in the Complex Hybrid Market
Wire bond interconnects have traditionally been considered "forward" bonded wires. Forward bonding refers to bonding from an integrated ...
Posted by Janine Powell on
Wire bond interconnects have traditionally been considered "forward" bonded wires. Forward bonding refers to bonding from an integrated ...
Posted by Janine Powell on
[For the English version, click here.] Il y a des myriades de différences entre la soudure eutectique ou le collage à l’époxy . Il existe ...
Posted by Janine Powell on
Today’s multipurpose wire bonding machines are required to deliver a combination of wires, bumps, and specialty interconnects for RF, ...
Posted by Janine Powell on
The importance of automobile maintenance and tune-up is analogous to wire and die bonder maintenance. Proper maintenance and tuning of your ...
Posted by Janine Powell on
[For the English version, click here.] 虽然虽半导体封装行业继续不断努力,设法缩小产品的体积以及永无止境的追求成本的节约,但是仍然有相当数量的应用程序需要一套完全不同的贴片和键合功能。 ...
Posted by Janine Powell on
Last week was the 15th anniversary of the Strategies in Light technical conference. Over 5,000 people attended the conference, and more ...
Posted by Janine Powell on
Supply chain management is a critical link in operational efficiency and customer satisfaction. Palomar manufactures products in Singapore ...
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Often when companies are discussing potential projects, they are at a crossroads on the most economical way to proceed with a small ...
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Though the trend is moving away from gold wire for high-volume production wire bonding, gold ball wire bonding still makes up about 50 ...
Posted by Janine Powell on
Much has been written about using Design of Experiments to optimize the input parameters to an automatic wire bonder in order identify the ...
Posted by Janine Powell on
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