PTI Blog

Bringing Old Bonder Equipment Back Online

While the word “mothball” has a negative connotation in our world of capital equipment, the fact is that the very definition of mothball is ...

Posted by Palomar Technologies MarCom Team on

Ball Bonding vs. Wedge Bonding

For many years, wire bonding has been the most robust and commonly used method for chip-to-die interconnection of lead-frame, integrated ...

Posted by Janine Powell on

自动化带状键合 (Automated Ribbon Bonding)

[For the English version, click here.] 随着传统的混合和光电子封装频率上升,导致基本的键合工艺产生问题。主要的问题是反应性电感的产生。除此之外,反应性电容也是一个问题。但是,导线的形状从圆形改为扁带形就能直接影响反应性电感这个最关键问题。 ...

Posted by Janine Powell on

An Introduction to Plasma Cleaning

Cleaning, Surface Modification, and Etching Process Plasma cleaning is defined as a process that uses an ionized gas to interact with a ...

Posted by Janine Powell on

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