As we reflect on the events of 2020 and anticipate their unfolding in 2021, our vision sharpens to reveal a clear trifecta of forces ...

Posted by Palomar Technologies MarCom Team on January 4

The year of 2020 will no doubt go down in history as one of the most difficult, life-changing years of the past century. At the beginning ...

Posted by Palomar Technologies MarCom Team on December 22

The die bonding, or die attach process, consists of attaching a die/chip to a substrate or package. This attachment can be performed with ...

Posted by Palomar Technologies MarCom Team on November 30

When it comes to microelectronics and photonics packaging assembly, components such as die are placed onto packages. All automated die ...

Posted by Palomar Technologies MarCom Team on November 16

Process development can present many challenges in the die attach market when the optimal process or package design varies drastically. ...

Posted by Palomar Technologies MarCom Team on October 27

Epoxy die attach, sometimes referred to as epoxy die bonding, is the most commonly used die attach method. Whether dispensed or daubed via ...

Posted by Palomar Technologies MarCom Team on August 20

Eutectic die attach involves bonding a chip or die to a surface using a solder alloy. These particular solder alloys are used because of ...

Posted by Palomar Technologies MarCom Team on August 12

With all eyes on 2050 and the mid-century point, a highly ambitious series of global programs are in place to reduce carbon emissions ...

Posted by Palomar Technologies MarCom Team on July 21

In the same way that iron, steam, and the telegraph marked a mega-shift in travel and military technologies for the mid-Victorian era, new ...

Posted by Palomar Technologies MarCom Team on July 1

[For the English version of this blog, please click here.] ...

Posted by Palomar Technologies MarCom Team on June 17