Debut of the 8100 Wire/Ball Bonder

Debut of the 8300 Series Automated Vacuum Pressure Soldering System

Debut of the 6532HP: Ultra High Accuracy Die Attach System

Debut of the SST 518 Vacuum Pressure Furnace

Debut of the SST QuikCool™ Auxillary Cooling Unit

VisionPilot^® with Radar Referencing^® for wire and wedge bonding

Debut of the 3880 Die Bonder

VisionPilot^® with Radar Referencing^® for die attach

Debut of the 9000 Wedge Bonder

Debut of the 8000i Wire Bonder/Ball Bumper

Intelligent Interactive Graphical Interface^® (i_²Gi^®) for wire bonding

Debut of the Ultra-Flexible 3800 Die Bonder

Debut of the precision eutectic 6500 Die Bonder

Debut of the 8000 Wire Bonder

Debut of the 8000 Ball Bumper, a variation of the 8000 Wire Bonder

Debut of the 3470-II Wedge Bonder

Debut of the 3500-III Automated Component Placement System

Debut of 2100C Laser Interferometer

Debut of the wafer scale packaging eutectic 6500 Die Bonder