About

Palomar® Technologies is a leading supplier of automated microelectronic assembly machines and contract assembly services with specialization in precision die attach, wire bonding and vacuum reflow solutions. We are proudly an independent USA-based company, owned and operated by local management.

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Applications

Palomar® Technologies provides interconnect solutions for a wide variety of industries and applications. With 45+ years supporting the semiconductor and photonics industries, we have expanded across automotive (LiDAR & power modules), medical, microwave, RF/wireless, Datacom, telecom and a few niche markets.

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Overview


Innovation Centers

Palomar® Technologies Innovation Centers are full-service advanced packaging laboratories offering solutions for process development, package prototyping, die attach, wire bonding, vacuum reflow, outsourced package assembly, test, and measurement.

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Resources

Get access to our entire knowledge database: read blog articles and download materials.

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Contact Us

Contact Palomar® Technologies for more information about our Total Process Solution including Palomar die bonders, Palomar wire and wedge bonders, SST vacuum reflow systems, along with Innovation Centers for outsourced manufacturing and assembly.

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Palomar Technologies

Making the Connected World Possible

A roadmap of Palomar® Technologies systems and technology releases

PALOMAR_8100

2020

Debut of the 8100 Wire/Ball Bonder
3800_hi_res-1.jpg

2010

Debut of the Ultra-Flexible 3800 Die Bonder

PALOMAR_6500_right_side_900
2000-2009

Debut of the precision eutectic 6500 Die Bonder

Debut of the 8000 Wire Bonder

Debut of the 8000 Ball Bumper, a variation of the 8000 Wire Bonder

Debut of the 3470-II Wedge Bonder

Debut of the 3500-III Automated Component Placement System

Debut of 2100C Laser Interferometer

Debut of the wafer scale packaging eutectic 6500 Die Bonder

1999-2000
Debut of the CBT automatic gold 6000 Wire Bonder

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