Adaptive Bond Deformation™ (ABD) for ultimate control over ball and stitch deformation
Bond Data Miner™
(BDM) is a software feature that provides part traceability, predictive process capability, and monitors machine fitness
Apparatus for Rapid Cooling of Substrates Utilizing a Flat Plate and Cooling Channels
(SST International U.S. Provisional Patent Application Serial No. 62/351,817)
Low Voiding Solder Paste Profile for Microelectronic Packaging
(SST International U.S. Provisional Patent Application Serial No. 62/357, 495)
Enhanced Loop Mode™
(ELM) provides exceptional long, low loop capability, with loops up to 10mm.
High Vacuum MEMs packaging with thermal Getter firing, and low chamber virtual leak design.
Low void solder technology utilizing Vacuum and Pressure with precise pressure and temperature control.
Free floating weights for optimized solder reflow.
Two zone heater control for large batch furnace temperature uniformity.
Cold wall process chamber design with high temperature application of 1000 Centigrade. For precise temperature control at extremely high temperatures. The chamber can be both high and low vacuum design.
High temperature wafer to wafer fusion bonder with high temperature up to 1000°C and 5 kilo Newton force
Intelligent Interactive Graphical Interface® or i2Gi (for wire bonding)