About

Palomar® Technologies is a leading supplier of automated microelectronic assembly machines and contract assembly services with specialization in precision die attach, wire bonding and vacuum reflow solutions. We are proudly an independent USA-based company, owned and operated by local management.

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Applications

Palomar® Technologies provides interconnect solutions for a wide variety of industries and applications. With 45+ years supporting the semiconductor and photonics industries, we have expanded across automotive (LiDAR & power modules), medical, microwave, RF/wireless, Datacom, telecom and a few niche markets.

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Overview


Innovation Centers

Palomar® Technologies Innovation Centers are full-service advanced packaging laboratories offering solutions for process development, package prototyping, die attach, wire bonding, vacuum reflow, outsourced package assembly, test, and measurement.

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Resources

Get access to our entire knowledge database: read blog articles and download materials.

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Contact Us

Contact Palomar® Technologies for more information about our Total Process Solution including Palomar die bonders, Palomar wire and wedge bonders, SST vacuum reflow systems, along with Innovation Centers for outsourced manufacturing and assembly.

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3880 bond head
New Product Introduction (NPI) Award for Bonders Winner: 3880 Die Bonder
Bruce Hueners

Ernst &Young Entrepreneur of the Year Finalist: Bruce Hueners

IMAPS 2015 Fellow of the Society Winner: Daniel Evans

8000i Wire Bonder
New Product Introduction (NPI) Award for Bonders Winner: 8000i Wire Bonder
Carl Hempel
Top Tech Exec Awards Finalist: Carl Hempel
Dan Evans

San Diego North Economic Development Council (SDNEC) Exporter of the Year Winner: Palomar Technologies

IMAPS 2012 John A. Wagnon Technical Achievement Winner: Daniel Evans 

Ernst & Young Entrepreneur of the Year Finalist: Bruce Hueners

CS Industry Awards, Manufacturing Finalist

Top Tech Exec Awards Finalist: Carl Hempel

3800 Die Bonder

Global SMT Technologies Awards for Bonders Finalist

TechAmerica High Tech Awards Finalist

IMAPS 2011 Corporate Recognition Award Winner

Appreciated Resolution Award for “Precision Assembly for High-Volume HB LEDs

Best Paper of the Session for “Evaluation of Test Protocol for Eutectic Die Attach Using High Brightness LEDs”

Ernst & Young Entrepreneur of the Year Finalist: Bruce Hueners

New Product Introduction (NPI) Award for Electronics Assembly Equipment Winner: 3800 Die Bonder

Global SMT Semiconductor Packaging Die Bonding Equipment Winner: 3800 Die Bonder

TechAmerica High Tech Awards Finalist

Certificate of Special Congressional Recognition presented by Congressman Duncan Hunter 

Semiconductor International Editor's Choice Best Product Award Winner: 3500 Die Bonder

Semiconductor International Editor's Choice Best Product Award Winner: 8000 Wire Bonder

Productronica's Global Technology Award Winner: 8000 Wire Bonder

UCSD Connect's Most Innovative New Product Award Winner: 8000 Wire Bonder

SEMICON West's Advanced Packaging Award Winner: 8000 Wire Bonder

Advanced Packaging Award for Die Placement and Attach Winner: Precision Eutectic 6500 Die Bonder

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