About us
![SST 8303](https://www.palomartechnologies.com/hubfs/Images/Photos%20for%20new%20website/2020%20Website%20Revamp%20Images/Product%20Pages/SST%208303/SST_8303_left_side_900.jpg)
2021
Laser Focus World
Innovator’s Award: SST 8300 Series Automated Vacuum Pressure Soldering System
Laser Focus World
Innovator’s Award: Palomar 8100 Wire Bonder
![PALOMAR 6532HP Die Bonder](https://www.palomartechnologies.com/hubfs/Images/Photos%20for%20new%20website/2020%20Website%20Revamp%20Images/Product%20Pages/Palomar%206532HP/PALOMAR_6532_left_side_900.jpg)
2019
Laser Focus World
Innovator's Award: Palomar 6532HP Die Bonder
![PALOMAR 3880 Die Bonder](https://www.palomartechnologies.com/hubfs/Images/Photos%20for%20new%20website/2020%20Website%20Revamp%20Images/Product%20Pages/Palomar%203880/PALOMAR_3880_right_side_1.jpg)
2016
New Product Introduction (NPI) Award for Bonders Winner: 3880 Die Bonder
![Bruce-Hueners](https://www.palomartechnologies.com/hubfs/Images/Headshots/Resized/Bruce-Hueners.jpg)
2015
Ernst &Young Entrepreneur of the Year Finalist: Bruce Hueners
IMAPS 2015 Fellow of the Society Winner: Daniel Evans
![PALOMAR_8000i Wire Bonder](https://www.palomartechnologies.com/hubfs/Images/Photos%20for%20new%20website/2020%20Website%20Revamp%20Images/Product%20Pages/Palomar%208000i/PALOMAR_8000i_front_2_600.jpg)
2014
New Product Introduction (NPI) Award for Bonders Winner: 8000i Wire Bonder
![Carl-Hempel](https://www.palomartechnologies.com/hubfs/Images/Headshots/Resized/Carl-Hempel.jpg)
2013
Top Tech Exec Awards Finalist: Carl Hempel
![Dan-Evans](https://www.palomartechnologies.com/hubfs/Images/Headshots/Resized/Dan-Evans.jpg)
2012
SDNEC Exporter of the Year Winner
IMAPS 2012 John A. Wagnon Technical Achievement Winner: Daniel Evans
Ernst & Young Entrepreneur of the Year Finalist: Bruce Hueners
CS Industry Awards, Manufacturing Finalist
Top Tech Exec Awards Finalist: Carl Hempel
![3800 Die Bonder](https://60069.fs1.hubspotusercontent-na1.net/hub/60069/file-26129917.gif)
2011
NPI Award for Electronics Assembly Equipment Winner: 3800 Die Bonder
Global SMT Technologies Awards for Bonders Finalist
TechAmerica High Tech Awards Finalist
IMAPS 2011 Corporate Recognition Award Winner
Appreciated Resolution Award for “Precision Assembly for High-Volume HB LEDs”
Best Paper of the Session for “Evaluation of Test Protocol for Eutectic Die Attach Using High Brightness LEDs”
Ernst & Young Entrepreneur of the Year Finalist: Bruce Hueners
![3800_opencover_transparent](https://60069.fs1.hubspotusercontent-na1.net/hub/60069/file-26129917.gif)
2010
Global SMT Semiconductor Packaging Die Bonding Equipment Winner: 3800 Die Bonder
TechAmerica High Tech Awards Finalist
Certificate of Special Congressional Recognition presented by Congressman Duncan Hunter
![3500 Die Bonder](https://60069.fs1.hubspotusercontent-na1.net/hub/60069/file-26129112.png)
2006
Semiconductor International Editor's Choice Best Product Award Winner: 3500 Die Bonder
![8000 Wire Bonder](https://60069.fs1.hubspotusercontent-na1.net/hub/60069/file-26171301.jpg)
2005
Semiconductor International Editor's Choice Best Product Award Winner: 8000 Wire Bonder
Productronica's Global Technology Award Winner: 8000 Wire Bonder
![8000](https://60069.fs1.hubspotusercontent-na1.net/hub/60069/file-26131214.png)
2004
UCSD Connect's Most Innovative New Product Award Winner: 8000 Wire Bonder
SEMICON West's Advanced Packaging Award Winner: 8000 Wire Bonder
![PALOMAR_6500 Die Bonder](https://www.palomartechnologies.com/hubfs/Images/Photos%20for%20new%20website/2020%20Website%20Revamp%20Images/Product%20Pages/Palomar%206500/PALOMAR_6500_right_side_900.jpg)
2003
Advanced Packaging Award for Die Placement and Attach Winner: Precision Eutectic 6500 Die Bonder