Laser Focus World
Innovator’s Award: SST 8300 Series Automated Vacuum Pressure Soldering System

Laser Focus World
Innovator’s Award: Palomar 8100 Wire Bonder

Laser Focus World
Innovator's Award: Palomar 6532HP Die Bonder

New Product Introduction (NPI) Award for Bonders Winner: 3880 Die Bonder

Ernst &Young Entrepreneur of the Year Finalist: Bruce Hueners

IMAPS 2015 Fellow of the Society Winner: Daniel Evans

New Product Introduction (NPI) Award for Bonders Winner: 8000i Wire Bonder

Top Tech Exec Awards Finalist: Carl Hempel

SDNEC Exporter of the Year Winner

IMAPS 2012 John A. Wagnon Technical Achievement Winner: Daniel Evans 

Ernst & Young Entrepreneur of the Year Finalist: Bruce Hueners

CS Industry Awards, Manufacturing Finalist

Top Tech Exec Awards Finalist: Carl Hempel

NPI Award for Electronics Assembly Equipment Winner: 3800 Die Bonder

Global SMT Technologies Awards for Bonders Finalist

TechAmerica High Tech Awards Finalist

IMAPS 2011 Corporate Recognition Award Winner

Appreciated Resolution Award for “Precision Assembly for High-Volume HB LEDs”

Best Paper of the Session for “Evaluation of Test Protocol for Eutectic Die Attach Using High Brightness LEDs”

Ernst & Young Entrepreneur of the Year Finalist: Bruce Hueners

Global SMT Semiconductor Packaging Die Bonding Equipment Winner: 3800 Die Bonder

TechAmerica High Tech Awards Finalist

Certificate of Special Congressional Recognition presented by Congressman Duncan Hunter 

Semiconductor International Editor's Choice Best Product Award Winner: 3500 Die Bonder

Semiconductor International Editor's Choice Best Product Award Winner: 8000 Wire Bonder

Productronica's Global Technology Award Winner: 8000 Wire Bonder

UCSD Connect's Most Innovative New Product Award Winner: 8000 Wire Bonder

SEMICON West's Advanced Packaging Award Winner: 8000 Wire Bonder

Advanced Packaging Award for Die Placement and Attach Winner: Precision Eutectic 6500 Die Bonder