8100 Wire/Ball Bonder

8100 Wire/Ball Bonder

Taking fine wire bonding to new levels of productivity and efficiency for both operators and engineers.  The newest Palomar fully automated, thermosonic high-speed, ball-and-stitch fine wire bonder capable of ball bumping and customized looping profiles. Based on Palomar’s proven wire bonder design and incorporating the latest productivity technology and operator ergonomics, making it the next generation of fine wire bonders.

Palomar Wire & Wedge Bonders
  • Large complex hybrids 
  • HB/HP LED arrays
  • Optoelectronic packaging
  • Chip-on-board (COB)
  • System in packages (SiPs)
  • Specialty lead frames
  • Automotive assemblies
  • Flex circuits
  • Multi-chip modules (MCMs)
  • Fine pitch devices
  • LEDs with running stitch
8100 Wire Bonder
8100 Wire Bonder
8100 Wire Bonder
8100 Wire Bonder
8100 Wire Bonder
8100 Wire Bonder
8100 Wire Bonder
8100 Wire Bonder

VisionPilot® with Vision Standardization

Utilizes advanced geometric pattern matching technology to reliably and accurately locate parts that are randomly oriented or have greyscale variations by using a set of boundary curves that are not tied to a traditional pixel-grid. Vision Standardization ensure consistency across systems and throughout the lifetime of the machine; reducing process maintenance and maximizing production.

Bond Data Miner

A comprehensive and centralized data management and analysis system that provides machine and process trend monitoring, storage and traceability of data across platforms, and closed loop process control for increased yields and predictive maintenance.

Automated Handler System

Automated inline handlers and conveyor systems to seamlessly bring parts in and out of the workspace. Custom designed for all process to fit all components and even apply heat for bot die and wire applications. Built with integration in mind for fully automatic assembly lines that can include all of our bonders.

Intelligent Interactive Graphical Interface® - i2Gi®

Supports advanced wire bond control through an intuitive interface that simplifies programming and provides real time graphical feedback to the user of bonding performance. Allows for a connected view with the ability to overlay 1:1 scaled graphics on top of live video of actual part.

Digitally Controlled NEFO Generator

Digitally controlled and displayed for precision parameter adjustments and real time process monitoring utilizing simple but comprehensive alerts. The graphical display of recent bonds facilitates effective process development.

Of Shoes and Toasters blog

If the Shoe Fits...

Full Service Bonders

Free Space Optics

FSO/AI Pushing Data Access and Evolution

Case Study: The Unintended Consequences of a Design Change

Case Study: The Unintended Consequences of a Design Change

Design for Manufacturing – Increasing Throughput to Achieve ROI

Scaling up from prototype to full-scale production

Scaling up from Prototype to Full-Scale Production

Contact us below and a representative will be in touch to help you with your wire bond needs.