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8100 Wire/Ball Bonder

Taking fine wire bonding to new levels of productivity and efficiency for both operators and engineers.  The newest Palomar fully automated, thermosonic high-speed, ball-and-stitch fine wire bonder capable of ball bumping and customized looping profiles. Based on Palomar’s proven wire bonder design and incorporating the latest productivity technology and operator ergonomics, making it the next generation of fine wire bonders.

8100 Wire/Ball Bonder

Taking fine wire bonding to new levels of productivity and efficiency for both operators and engineers.  The newest Palomar fully automated, thermosonic high-speed, ball-and-stitch fine wire bonder capable of ball bumping and customized looping profiles. Based on Palomar’s proven wire bonder design and incorporating the latest productivity technology and operator ergonomics, making it the next generation of fine wire bonders.

Category
Palomar Wire & Wedge Bonders

Processes
  1. Ball Bumping
  2. Gold Wire Bonding

Applications
  • Large complex hybrids 
  • HB/HP LED arrays
  • Optoelectronic packaging
  • Chip-on-board (COB)
  • System in packages (SiPs)
  • Specialty lead frames
  • Automotive assemblies
  • Flex circuits
  • Multi-chip modules (MCMs)
  • Fine pitch devices
  • LEDs with running stitch

Media

8100 Wire Bonder
8100 Wire Bonder
8100 Wire Bonder
8100 Wire Bonder
8100 Wire Bonder
8100 Wire Bonder
8100 Wire Bonder
8100 Wire Bonder

KEY FEATURES

VisionPilot® with Vision Standardization
Bond Data Miner
Automated Handler System
Intelligent Interactive Graphical Interface
Digitally Controlled NEFO Generator
VisionPilot® with Vision Standardization Bond Data Miner Automated Handler System Intelligent Interactive Graphical Interface Digitally Controlled NEFO Generator
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