1200 Table Top Furnace


The SST 1200 is a table top vacuum and pressure furnace designed for process development and low volume production of flux-free and void-free soldered joints in microelectronic packages and components. The station is easy to use and designed for a wide variety of soldering tasks. A ramping temperature controller is combined with customized programmable logic controller (PLC) to provide automatic process control.

1200 Table Top Furnace
Die Bonding on the 1200 Table Top Furnace

The 1200 table top furnace is ideal for small labs and R&D facilities. Void-free solder joints are most reliably obtained through a carefully controlled and sequenced combination of heat, vacuum, and pressurized inert gas.


Void-Free Die Soldering. Void-free die and substrate solder attach is used to create a uniform thermal interface for high-reliability microelectronic devices.

Hermetic Package Sealing. Hermetic package sealing uses solder or glass to create a barrier to moisture which will damage sensitive electrical circuit components.


  • Semi-programmable vacuum furnace
  • Creates void-free, flux-free joints
  • Precise heat and cool controls
  • Temperature up to 450°C
  • Vacuum below 100 millitorr
  • Pressure to 50 psig
  • Unlimited process profiles
  • Temperature controller with PLC
  • Single chamber process


  • Automotive diodes
  • CPV solar cell modules
  • Fiber optic devices
  • Flip chips
  • GaN MMICs
  • Hearing aid amplifiers
  • Hermetic feed-throughs
  • Implantable medical devices
  • Laser pump diodes
  • LED lamps and heaters
  • Microwave packages
  • Miniature crystals
  • MMICs
  • Oscillators
  • Pacemakers
  • Power modules
  • Pressure sensors
  • Resistor networks
  • RF amplifiers

Download 1200 Table Top Furnace Data Sheet

Download 1200 Table Top Furnace Data Sheet

Graphite, ceramic, and metal fixtures are required for most microelectronic assembly processes. Learn more about tooling.
Find Out
Other Resources
3880 Die Bonder Data Sheet
3150 High Vacuum Furnace Data Sheet
Automated Eutectic Die Attach Technical Paper
Buyer's Guide to Microelectronics Packaging Equipment eBook