Designed for fully automated epoxy and eutectic die attach processes, the 3880 Die Bonder combines fine placement accuracy, fast indexing time, and excellent tool planarity and repeatability make it the most advanced die bonder platform available today. Its innovative integrated Z-Theta bidirectional 8-tool bond head makes it the fastest and most reliable multiple die-type bonder on the market. READ MORE
HIGH RELIABILITY, HIGH QUALITY POWER MODULES
Specifically designed to deliver the highest quality electronic packaging for power modules, the SST 8300 Series Automated Vacuum Pressure Soldering System provides a highly reliable solder connection with a better than industry standard void rate – key to delivering high reliability power modules for automotive and commercial applications. LEARN MORE!
PRESSURE-LESS SILVER SINTERING FOR RF POWER ELECTRONICS
Silver sintering technology has been around since the 1980s, but the process has faced numerous problems. The limits of traditional sintering, rapidly growing market demand, 5G, evolving technologies, issues of energy and eco-sustainability, as well as lead-free requirements have led many (including Palomar Technologies) to revisit these challenges. READ THE ARTICLE!