Palomar® Technologies is a leading supplier of automated microelectronic assembly machines and contract assembly services with specialization in precision die attach, wire bonding and vacuum reflow solutions. We are proudly an independent USA-based company, owned and operated by local management.
Palomar® Technologies provides interconnect solutions for a wide variety of industries and applications. With 45+ years supporting the semiconductor and photonics industries, we have expanded across automotive (LiDAR & power modules), medical, microwave, RF/wireless, Datacom, telecom and a few niche markets.
Palomar® Technologies Innovation Centers are full-service advanced packaging laboratories offering solutions for process development, package prototyping, die attach, wire bonding, vacuum reflow, outsourced package assembly, test, and measurement.
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Contact Palomar® Technologies for more information about our Total Process Solution including Palomar die bonders, Palomar wire and wedge bonders, SST vacuum reflow systems, along with Innovation Centers for outsourced manufacturing and assembly.
The newest Palomar fully automated, thermosonic high-
speed, ball-and-stitch fine wire bonder capable of ball
bumping and customized looping profiles. Based on
Palomar’s proven wire bonder design and incorporating the
latest productivity technology and operator ergonomics,
making it the next generation of fine wire bonders.
SERVING EUROPEAN CUSTOMERS' PHOTONICS AND MICROELECTRONICS NEEDS
Palomar’s Demonstration/Prototyping Lab is strategically located within the new Electronics and Photonics Innovation Center (EPIC) in Paignton (Torbay), the heart of a vibrant electronics and photonics cluster in the United Kingdom. EPIC is a center of excellence, supporting technological innovation and promoting collaborative activity between businesses and research institutions. LEARN MORE ABOUT OUR DEMO LAB!
INNOVATION CENTERS — FROM PROTOTYPE TO PRODUCTION
Development of complex technologies continues to grow at a rapid pace, challenging existing technology giants and start-ups alike to keep pace with the growing demands for higher data capacity, faster speed, smaller designs and more sustainable solutions that are the foundation of the connected world. With today’s rapidly changing technology, time-to-market is one of the most important factors for product success. LEARN MORE!
PRESSURE-LESS SILVER SINTERING FOR RF POWER ELECTRONICS
Silver sintering technology has been around since the 1980s, but the process has faced numerous problems. The limits of traditional sintering, rapidly growing market demand, 5G, evolving technologies, issues of energy and eco-sustainability, as well as lead-free requirements have led many (including Palomar Technologies) to revisit these challenges. READ THE ARTICLE!