Introducing the SST 8300 Series Automated Vacuum Pressure Soldering System.
Specifically designed to deliver the highest quality electronic packaging for power modules, the system provides a highly reliable solder connection with a better than industry standard void rate – key to delivering high reliability power modules for automotive and commercial applications.
The 8300 Series utilizes SST’s unique system of applying both vacuum and gas pressure to achieve an extremely low-void rate for the soldering interface of key components inside a power module, especially for DBC-to-baseplate soldering.
Designed for fully automated epoxy and eutectic die attach processes, the 3880 Die Bonder combines fine placement accuracy, fast indexing time, and excellent tool planarity and repeatability make it the most advanced die bonder platform available today. Its innovative integrated Z-Theta bidirectional 8-tool bond head make it the fastest and most reliable multiple die-type bonder on the market.
The 9000 Wedge Bonder is a high-speed fine wire wedge and ribbon bonder, offering the flexibility to change wire feed angles to 45-60° or 90°deep access on a single large work area. Its key differentiators - such as the large work area, high precision and no surface touch - help customers achieve modern wedge bond requirements.
IEEE Electronic Components and Technology Conference
Las Vegas, NV | booth #408
Make an appointment with us during this event
Power Semiconductors have enjoyed steady growth for at least the last 15 years, with only the occasional down turn. It is expected that the global market will continue to drive more energy consumption (roughly 20TWh is currently used today). However, the market will push for energy savings through improved efficiencies and it will seek higher performances in power electronics. READ MORE