SST Parts & Service: +1 (562) 803-1677     Palomar Parts & Service: +1 (760) 931-3600     info@bonders.com     
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About

Palomar® Technologies is a leading supplier of automated microelectronic assembly machines and contract assembly services with specialization in precision die attach, wire bonding and vacuum reflow solutions. We are proudly an independent USA-based company, owned and operated by local management.

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Applications

Palomar® Technologies provides interconnect solutions for a wide variety of industries and applications. With 45+ years supporting the semiconductor and photonics industries, we have expanded across automotive (LiDAR & power modules), medical, microwave, RF/wireless, Datacom, telecom and a few niche markets.

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Overview


Innovation Centers

Palomar® Technologies Innovation Centers are full-service advanced packaging laboratories offering solutions for process development, package prototyping, die attach, wire bonding, vacuum reflow, outsourced package assembly, test, and measurement.

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Resources

Get access to our entire knowledge database: read blog articles and download materials.

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Contact Us

Contact us for more info about our Total Process Solution including die bonders, wire and wedge bonders, SST vacuum reflow systems, and Innovation Centers.

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Introducing the New 3880-II Die Bonder


A solid investment for maximizing productivity – from R&D to volume, automated bonding – all in one bonder. The new Palomar 3880-II Die Bonder is based on Palomar’s proven die bonder design but includes options to even further maximize productivity, reduce programming time by up to 95%, and improve the overall bonder productivity. The highly flexible Palomar 3880-II is ideally suited for a range of markets and applications.

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SERVING EUROPEAN CUSTOMERS' PHOTONICS AND MICROELECTRONICS NEEDS

Palomar’s Demonstration/Prototyping Lab is strategically located within the new Electronics and Photonics Innovation Center (EPIC) in Paignton (Torbay), the heart of a vibrant electronics and photonics cluster in the United Kingdom. EPIC is a center of excellence, supporting technological innovation and promoting collaborative activity between businesses and research institutions. LEARN MORE ABOUT OUR DEMO LAB!


HIGH RELIABILITY ELECTRONICS COMPONENTS

The SST 5100 Programmable Vacuum Pressure Furnace creates void-free solder joints without the use of flux, resulting in high reliability electronic components. It is ideally suited for high vacuum MEMS packaging, hermetic package sealing, solder paste reflow attach and fluxless eutectic solder attach.  LEARN MORE!


INTRODUCING THE PALOMAR 8100 WIRE BONDER (BALL/STUD BUMPER)

The newest Palomar fully automated, thermosonic high-speed, ball-and-stitch fine wire bonder capable of ball bumping and customized looping profiles. Based on Palomar’s proven wire bonder design and incorporating the latest productivity technology and operator ergonomics, making it the next generation of fine wire bonders.
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