Designed for fully automated epoxy and eutectic die attach processes, the 3880 Die Bonder combines fine placement accuracy, fast indexing time, and excellent tool planarity and repeatability make it the most advanced die bonder platform available today. Its innovative integrated Z-Theta bidirectional 8-tool bond head make it the fastest and most reliable multiple die-type bonder on the market. READ MORE
COLLABORATIVE MANUFACTURING IN PHOTONICS PACKAGING
In this highly competitive photonics market, entering the new product introduction phase with little or no packaging expertise is likely to lengthen critical time to market. Shorten time to market, reduce design failures and high rejection rates by using a collaborative manufacturing process, state-of-the-art automated packaging equipment, and guidance from advanced packaging experts.
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HIGH PRECISION, HIGH PERFORMANCE, HIGH PRODUCTION
The Palomar 6532HP Die Bonder — 1.5 micron die bonding placement accuracy for the optoelectronics market. Exceeding standards, the 6532HP is exceptionally accurate, the newest high-precision, high-performance, high-production die bonder in the world. Fully automated, high capacity feeders maximize your production and ROI. GET THE DATA SHEET!