Introducing the SST 8300 Series Automated Vacuum Pressure Soldering System.
Specifically designed to deliver the highest quality electronic packaging for power modules, the system provides a highly reliable solder connection with a better than industry standard void rate – key to delivering high reliability power modules for automotive and commercial applications.
The 8300 Series utilizes SST’s unique system of applying both vacuum and gas pressure to achieve an extremely low-void rate for the soldering interface of key components inside a power module, especially for DBC-to-baseplate soldering.
Designed for fully automated epoxy and eutectic die attach processes, the 3880 Die Bonder combines fine placement accuracy, fast indexing time, and excellent tool planarity and repeatability make it the most advanced die bonder platform available today. Its innovative integrated Z-Theta bidirectional 8-tool bond head make it the fastest and most reliable multiple die-type bonder on the market.
The 9000 Wedge Bonder is a high-speed fine wire wedge and ribbon bonder, offering the flexibility to change wire feed angles to 45-60° or 90°deep access on a single large work area. Its key differentiators - such as the large work area, high precision and no surface touch - help customers achieve modern wedge bond requirements.
Carlsbad, CA – June 18, 2019 – Palomar Technologies, a global leader in delivering total process solutions for advanced photonics and microelectronic device packaging, announced today it is partnering with the Electronics and Photonics Innovation Center (EPIC) to establish a Palomar Demonstration Laboratory. As part of the partnership, Palomar is investing 1M USD in equipment, including a fully loaded 3880 Die Bonder and an 8000i Ball / Bump Wire Bonder for use by customers at the EPIC facility in Paignton (Torbay), the heart of a vibrant electronics and photonics cluster in the United Kingdom. READ MORE
Palomar Technologies recently sent two delegates to EPIC’s Packaging Conference, hosted by ASM Amicra, in Regensburg, Germany. The annual event showcases advances in packaging technologies, as well as new approaches furthering a wide range of innovation solutions. Palomar’s Product Marketing Manager, Evan Hueners, presented aspects of Palomar’s experience in supporting EEL and VCSEL facilitated LiDAR devices. He stated that sustainable advances in manufacturing efficiencies are as central to the future of commercial design and production, as are technical improvements, better physical specifications, or even tighter tolerances.