High Reliability, High Quality
Power Modules


Introducing the SST 8300 Series Automated Vacuum Pressure Soldering System.

Specifically designed to deliver the highest quality electronic packaging for power modules, the system provides a highly reliable solder connection with a better than industry standard void rate – key to delivering high reliability power modules for automotive and commercial applications.

The 8300 Series utilizes SST’s unique system of applying both vacuum and gas pressure to achieve an extremely low-void rate for the soldering interface of key components inside a power module, especially for DBC-to-baseplate soldering.

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3880DieBonder
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Palomar 6532HP Die Bonder Video 01292019


3880 DIE BONDER — ACCURACY, CONSISTENCY, ADAPTABILITY

Designed for fully automated epoxy and eutectic die attach processes, the 3880 Die Bonder combines fine placement accuracy, fast indexing time, and excellent tool planarity and repeatability make it the most advanced die bonder platform available today. Its innovative integrated Z-Theta bidirectional 8-tool bond head make it the fastest and most reliable multiple die-type bonder on the market.  READ MORE


COLLABORATIVE MANUFACTURING IN PHOTONICS PACKAGING

In this highly competitive photonics market, entering the new product introduction phase with little or no packaging expertise is likely to lengthen critical time to market. Shorten time to market, reduce design failures and high rejection rates by using a collaborative manufacturing process, state-of-the-art automated packaging equipment, and guidance from advanced packaging experts.  
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HIGH PRECISION, HIGH PERFORMANCE, HIGH PRODUCTION

The Palomar 6532HP Die Bonder — 1.5 micron die bonding placement accuracy for the optoelectronics market. Exceeding standards, the 6532HP is exceptionally accurate, the newest high-precision, high-performance, high-production die bonder in the world. Fully automated, high capacity feeders maximize your production and ROI. GET THE DATA SHEET!

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