Exceeding standards, the 6532HP is exceptionally accurate, the newest high-precision, high-performance, high-production die bonder in the world. Fully automated, high capacity feeders maximize your production and ROI.
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Designed for fully automated epoxy and eutectic die attach processes, the 3880 Die Bonder combines fine placement accuracy, fast indexing time, and excellent tool planarity and repeatability make it the most advanced die bonder platform available today. Its innovative integrated Z-Theta bidirectional 8-tool bond head make it the fastest and most reliable multiple die-type bonder on the market.
The 9000 Wedge Bonder is a high-speed fine wire wedge and ribbon bonder, offering the flexibility to change wire feed angles to 45-60° or 90°deep access on a single large work area. Its key differentiators - such as the large work area, high precision and no surface touch - help customers achieve modern wedge bond requirements.
IEEE Electronic Components and Technology Conference
Las Vegas, NV | booth #408
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CARLSBAD, CA – March 12, 2019 – Palomar Technologies, a global leader in total process solutions for advanced photonics and microelectronic device packaging, announced that SST Vacuum Reflow Systems, a wholly owned subsidiary of Palomar Technologies, will be presenting at the iMAPS-UK Microtech 2019: Power in Packaging on April 4, 2019 in Cambridge, UK. The presentation will evaluate an assembly process using a flux-free, vacuum pressure solder reflow system to deliver a reliable, low-void attachment of key components commonly used to assemble IGBT/Power Modules. READ MORE
by Rich Hueners
Over the past several years, R&D spending, innovation, and invention has increased in Asia as these economies become more developed and their technology prowess more sophisticated. Today, there is substantial demand for advanced photonics packaging process development to bridge between mini-production ramps and high-volume production in Asia. READ MORE