INDUSTRY AFFILIATIONS & MEMBERSHIPS
DECADES OF ENGINEERING EXPERTISE, BUILT INTO EVERY ASSEMBLY
30+ years of application engineering and materials science experience.
Thousands of systems installed around the world.
Total Solution Partner
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Core Manufacturing Processes
Built around proven processes, our engineers work across three core assembly disciplines, often in combination, to meet the precision and reliability demands of your specific program.
Die Bonding
Die bonding precisely attaches semiconductor dies to substrates, packages, or other dies using methods such as epoxy, eutectic, flip chip, and vacuum-assisted bonding. Palomar’s automated systems provide micron-level accuracy, strong thermal performance, and low-void attachment for advanced microelectronics and photonics.
Wire Bonding
Wire bonding creates precise electrical connections between semiconductor devices using fine gold or aluminum wire. Palomar provides automated wire bonding solutions for ball, wedge, ribbon, and stud bumping applications with micron-level accuracy.
Vacuum Reflow
Vacuum reflow combines precise temperature control with regulated pressure to create strong, low-void solder joints. Palomar's vacuum reflow systems enable fluxless, highly reliable bonding for advanced semiconductor and microelectronics packaging.
SOLUTIONS built for
your application
Serving teams where assembly failure is not an option: in aerospace and defense, medical devices, photonics, advanced semiconductors, AI hardware, and quantum technology. If your application is complex, low-volume, and high-stakes, we know
your world.
Trusted for Mission-Critical Manufacturing
We build machines that deliver consistent, repeatable results in demanding field environments, designed for high-mix, low-volume production where accuracy, repeatability, and reliability are essential.
The Palomar 9100 Wedge Bonder is a high-speed fine wire and ribbon bonder featuring voice coil technology and interchangeable deep-access wedge clamps. Its theta-mounted bond head improves wire tension, shortens the feed path, prevents twisting, and delivers precise process control across a large work area.
The Palomar 9100 Wedge Bonder is a high-speed fine wire and ribbon bonder featuring voice coil technology and interchangeable deep-access wedge clamps. Its theta-mounted bond head improves wire tension, shortens the feed path, prevents twisting, and delivers precise process control across a large work area.
Palomar’s next-generation fully automated thermosonic fine wire bonder delivers high-speed ball-and-stitch bonding, ball bumping, and customized looping profiles. Built on a proven platform, it combines advanced productivity technology with improved operator ergonomics for greater efficiency and performance.
Palomar’s next-generation fully automated thermosonic fine wire bonder delivers high-speed ball-and-stitch bonding, ball bumping, and customized looping profiles. Built on a proven platform, it combines advanced productivity technology with improved operator ergonomics for greater efficiency and performance.
The SST 5100 is a programmable vacuum/pressure furnace that produces void-free, flux-less solder joints for highly reliable electronic components. It provides uniform infrared heating up to 500°C and controlled inert-gas cooling across vacuum levels below 50 millitorr and pressures up to 40 psig.
The SST 5100 is a programmable vacuum/pressure furnace that produces void-free, flux-less solder joints for highly reliable electronic components. It provides uniform infrared heating up to 500°C and controlled inert-gas cooling across vacuum levels below 50 millitorr and pressures up to 40 psig.
KNOWLEDGE CENTER
Stay current with Palomar's latest technical resources, application notes, and industry insights.
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Frequently Asked Questions
What does Palomar Technologies make, and who is it for?
Palomar Technologies designs and manufactures automated microelectronic assembly equipment, including die bonders, wire and wedge bonders, and SST vacuum reflow systems, for engineers and manufacturers working in photonics, semiconductors, RF/microwave, power electronics, automotive, medical, and high-reliability applications. In addition to equipment, Palomar's OSAT services provide contract assembly, process development, and prototyping services for organizations that need specialized packaging expertise without building in-house capacity.
What types of die bonding and wire bonding equipment does Palomar offer?
Palomar offers a range of automated die bonders, including the 3880-II, 6532HP, and 6500 models, capable of epoxy, eutectic, solder paste, silver sintering, UV, and thermocompression die-attach processes. For interconnect, the 8100 Ball/Wire Bonder handles gold and aluminum ball bonding, while the 9000 Wedge Bonder is suited for aluminum and heavy-wire wedge bonding. All platforms support proprietary features such as VisionPilot® vision alignment and Bond Data Miner process analytics.
Can Palomar Technologies help with process development or prototyping before I commit to production equipment?
Yes. Palomar's Advanced Solutions Division operates full-service assembly and test labs in North America and Asia. These labs provide process development, package prototyping, and low- to mid-volume contract assembly for die attach, wire bonding, and vacuum reflow. Engineers can evaluate feasibility, qualify a new die attach material, or bridge to production volume without purchasing equipment upfront. The team can also provide a "Prepare for Manufacturing" assessment to help organizations define process requirements before capital investment.
Which industries and applications are Palomar's systems suited for?
Palomar's equipment and assembly services are used across photonics, automotive electronics, laser diode packaging, LEDs, medical and biophotonics, military and high-reliability (including MEMS), power semiconductors, RF and microwave devices, sensors, and telecom/5G/datacom. The common thread is precision applications where placement accuracy, bond integrity, and process repeatability directly affect device performance or long-term reliability. Palomar's application pages map specific products and processes to each market segment, helping engineers identify the right starting point.
