Designed for fully automated epoxy and eutectic die attach processes, the 3880 Die Bonder combines fine placement accuracy, fast indexing time, and excellent tool planarity and repeatability make it the most advanced die bonder platform available today. Its innovative integrated Z-Theta bidirectional 8-tool bond head makes it the fastest and most reliable multiple die-type bonder on the market. READ MORE
9000 WEDGE BONDER — CONTROL, SPEED, FLEXIBILITY
The 9000 Wedge Bonder is a high-speed fine wire wedge and ribbon bonder driven by voice coil technology in the bond head. This machine has interchangeable 45-60° and 90° deep access wedge clamps and operates across a single large 304 x 152 mm work area, which provides users flexibility to work with many different work holder sizes and tooling. GET THE DATA SHEET!
HIGH PRECISION, HIGH PERFORMANCE, HIGH PRODUCTION
The Palomar 6532HP Die Bonder — 1.5 micron die bonding placement accuracy for the optoelectronics market. Exceeding standards, the 6532HP is exceptionally accurate, the newest high-precision, high-performance, high-production die bonder in the world. Fully automated, high capacity feeders maximize your production and ROI. GET THE DATA SHEET!