Developed for the demanding needs of the optoelectronics market, the 6532HP exceeds industry standards for placement accuracy and production speed. 1.5 micron high precision placement accuracy and speeds up to 1200 UPH means maximum throughput for you and your customers. Automated presentation of dual 8” wafers, or up to 72 wafflepacks, or tape dispensers provides a high production, flexible parts presentation platform. The 6 position, bi-directional tool turret allows “on-the-fly” tool changes to maximize speed and flexibility.
A variety of options and variations adds flexibility to the 6532HP and allow you to package the widest range of optoelectronic devices on a single system. Adding VisionPilot® with Radar Referencing® ensures accurate parts identification, location and placement, thus reducing raw material cost and eliminating fixturing requirements.