3880 Bond head turret

6532HP Die Bonder


Developed for the demanding needs of the optoelectronics market, the 6532HP exceeds industry standards for placement accuracy and production speed. 1.5 micron high precision placement accuracy and speeds up to 1200 UPH means maximum throughput for you and your customers. Automated presentation of dual 8” wafers, or up to 72 wafflepacks, or tape dispensers provides a high production, flexible parts presentation platform. The 6 position, bi-directional tool turret allows “on-the-fly” tool changes to maximize speed and flexibility.


6532HP Die Bonder

A variety of options and variations adds flexibility to the 6532HP and allow you to package the widest range of optoelectronic devices on a single system. Adding VisionPilot® with Radar Referencing® ensures accurate parts identification, location and placement, thus reducing raw material cost and eliminating fixturing requirements.

  • Steady state or pulse heat stages, dispensing capability, daub pot epoxy dispense, look up cameras and remote machine control software are all available to help configure your system.
Palomar 6532HP Die Bonder Video 01292019

Multiple Options in a Single Machine

  • 1.5 um accuracy
  • High volume capacity
  • Fully automated operations
  • Up to 1200 UPH
  • 6-tool bi-directional tool turret
  • Wafer, Waffle/Gel Pak/Tape and reel material presentation stages


  • High capacity magazine handler
  • Fluid dispensers
  • Epoxy daub/stamp tools
  • Air bearing table
  • Steady state or pulse heat stages
  • Flip chip (90°-180°)


  • Double-pick process protected under US Patent 6,776,327

Download the 6532HP Die Bonder Data Sheet

Download the 6532HP Die Bonder Data Sheet

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Other Resources
Data Sheet White@2x.png Learn About Automated Eutectic Die Attach
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Data Sheet White@2x.png Learn more about Automated Flip Chip Assembly