3250 High Vacuum Wafer Furnace

3250 High Vacuum Wafer Furnace

The SST 3250 is a high vacuum multi-atmosphere sealing furnace that has been designed for lid sealing on wafers of 150-200mm diameter. The system is fully operational at vacuum levels of 10E-07 Torr up to 12 psig with automatic selection and control of up to three process gasses. A closed-loop electronic pressure controller with integral capacitance manometer provides fine control of pressure and flow throughout the full operating range of the system.

Category
SST High Vacuum Furnaces
Applications
  • MEMS Package Sealing
  • Void-Free Eutectic Die Attach
  • Infrared Sensor Package Sealing
  • Low Moisture Package Sealing
  • Wafer Level Packaging
  • Military Electronic Package Sealing
3250 Chamber View
3250 Application in Chamber Example
3250 Operator Interaction
3250 Chamber Open

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Run analyzer provides ability to graphically review data from logged profiles and export data. This includes real-time display of the thermal and pressure profiles as well as the ability to aid in process development by helping identify plating or material changes in your products.

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