About

Palomar® Technologies is a leading supplier of automated microelectronic assembly machines and contract assembly services with specialization in precision die attach, wire bonding and vacuum reflow solutions. We are proudly an independent USA-based company, owned and operated by local management.

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Applications

Palomar® Technologies provides interconnect solutions for a wide variety of industries and applications. With 45+ years supporting the semiconductor and photonics industries, we have expanded across automotive (LiDAR & power modules), medical, microwave, RF/wireless, Datacom, telecom and a few niche markets.

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Overview


Innovation Centers

Palomar® Technologies Innovation Centers are full-service advanced packaging laboratories offering solutions for process development, package prototyping, die attach, wire bonding, vacuum reflow, outsourced package assembly, test, and measurement.

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Resources

Get access to our entire knowledge database: read blog articles and download materials.

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Contact Us

Contact Palomar® Technologies for more information about our Total Process Solution including Palomar die bonders, Palomar wire and wedge bonders, SST vacuum reflow systems, along with Innovation Centers for outsourced manufacturing and assembly.

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Press Release

Palomar Technologies offers Free Webinar on Unparalleled Die Bonding Flexibility for Next-Gen Photonics Packaging

Posted by Palomar Technologies MarCom Team on Mon, Apr 12, 2021 @ 03:00 PM

Webinar: April 28, 2021 at 8am PST

Carlsbad, CA – April 12, 2021 Palomar Technologies, a global leader in delivering total process solutions for advanced photonics and microelectronic device packaging, announced today they are offering a webinar achieving die bonding flexibility for the next-generation of photonics packaging currently in development.

Much of the semiconductor packaging industry is engaged in an exciting and growing photonics ecosystem. Anticipating a seven percent CAGR over the next five years, this clearly outpaces most other manufacturing sectors. The associated challenges of photonics packaging, specifically relating to optical transceivers, include meeting anticipated performance gains while squeezing large package functionality into smaller, more thermally efficient footprints.

Palomar Technologies’ 3880 Die Bonder provides the flexibility and versatility to handle the many challenges present in both the current and next generation of photonics packaging. Not only is the 3880 capable of a diverse range of processes from epoxy dispense, to UV snap cure, to eutectic die attach, but can scale with production volume for low volume process development to full-scale high volume production. In this webinar, Kyle Schaefer, Palomar Product Marketing Manager, reviews the challenges of photonics packaging and visits Live with Martyn Davies, New Business Development from Palomar Technologies UK, at the Palomar Demo Lab in the EPIC Center in Paignton, UK. Martyn will provide a live overview of the Palomar 3880 capabilities for photonics packaging.

The webinar takes place on April 28, 2021 at 8am PST. Registration is through the link below:

https://www.palomartechnologies.com/events/WEBINAR-Unparalleled-Die-Bonding-Flexibility-Next-Gen-Photonics-Packaging

Webinar_Die_Bonding_Flexibility_for_Next-Gen_Photonics

About Palomar Technologies
Palomar Technologies makes the connected world possible by delivering a Total Process Solution™ for advanced photonic and microelectronic device assembly processes utilized in today’s smart, connected devices. With a focus on flexibility, speed and accuracy, Palomar’s Total Process Solution includes Palomar die bonders, Palomar wire and wedge bonders, SST vacuum reflow systems, along with Innovation Centers for outsourced manufacturing and assembly, and Customer Support services, that together deliver improved quality and yield, reduced assembly times, and rapid ROI.

With its deep industry expertise, Palomar equips customers to become leaders in the development of complex, digital technologies that are the foundation of the connected world and the transmission of data generated by billions of connected devices. Palomar solutions are utilized by the world’s leading companies providing solutions for datacom, 5G, electric vehicle power modules, autonomous vehicles/LiDAR, enhanced mobile broadband, Internet of Things, SMART technology, and mission-critical services.

Headquartered in Carlsbad, California, Palomar offers global sales, service and application support from its offices in the USA, Germany, Singapore, and China. For more information, visit: http://www.palomartechnologies.com

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Media Contact:
Rebecca Janzon
Global Corporate Communications Director
Email: rjanzon@bonders.com
Mobile: 760-409-7453