Hermetic package sealing processes with solder or glass frit are used to isolate critical microelectronic circuits from the surrounding environment. Hermetic packaging materials are usually ceramic or metal and are sealed with a metal solder or solder-glass joint.

Introducing the SST 8300 Series Automated Vacuum Pressure Soldering System

The new SST 8300 Series, consisting of single and triple chamber systems provides a highly reliable solder connection with a better than industry standard void rate – key to delivering high reliability power modules for automotive and commercial applications.

The power module market is actively seeking a flux-free solder process that achieves low void rates, which provide for higher reliability and longer life.

The SST 8300 Series Automated Vacuum Pressure Soldering System differs from current systems on the market by utilizing SST’s unique system of applying both vacuum and gas pressure for the soldering interface of key components inside a power module, especially for DBC-to-base plate soldering.

8301-Three Quarter View-With Glass-SST International-9248Final -cropped (2)
SST 3150 High Vacuum Furnace

SST 3150 High Vacuum Furnace

The Model 3150 High Vacuum Furnace is used for activating getters, sealing of discrete MEMS packages, and other sealing and brazing processes. Packages are hermetically sealed with very low vacuum and moisture levels for extended, long term performance.

The 5100 Vacuum Pressure Furnace is used for high production void-free soldering of microelectronic packages and components. Its vacuum and pressure furnace provides precise automatic control of heating and cooling ramp rates. Process heating is provided over the entire work area by a close-coupled planar infrared heating element. This system allows for heating up to 500°C and cooling in an inert gas environment from vacuum levels below 50 millitorr to pressures up to 40 psig.
SST 3130 Vacuum Pressure Furnace

SST 3130 Vacuum Pressure Furnace. The Model 3130 Vacuum Pressure Furnace is used for production soldering, glass sealing, and brazing of microelectronic packages and components. A deep chamber resistive heat vacuum and pressure furnace for void free solder joints without use of flux, resulting in high precision electronic components.