3880 Die Bonder

The Palomar 3880 Die Bonder component placement die attach system features a state of the art, integrated Z-Theta bidirectional 8-tool bond head, making it the fastest, most reliable, and flexible multiple die bonder on the market. Designed based on industry-proven capabilities, the Palomar 3880’s versatility includes both eutectic and epoxy die attach, flip chip, as well as a range of options in a single machine.

Category Palomar Die Bonders Processes

Silver Sintering Die Bonding, Eutectic Die Bonding, Epoxy Die Bonding, UV Die Bonding, Solder Paste Die Bonding, Thermocompression Die Bonding

Applications
  • AOC - Active optical cable
  • Chip-on-board 
  • HB/HP LED assembly 
  • Microwave modules 
  • RF packages 
  • Hybrid microcircuits 
  • MEMS / MOEMS 
  • VCSEL, PD, DFB Laser, Lens Attach 
  • Solid state lasers 
  • RF GaN 5G power amplifiers 
  • LED printhead attachment 
  • RF power amplifier

3880 v3 - 03082019
VisionPilot

VisionPilot®

Utilizes advanced geometric pattern matching technology to reliably and accurately locate parts that are randomly oriented or have greyscale variations by using a set of boundary curves that are not tied to a traditional pixel-grid. Maximizes throughput, and enables part inspection both before and after bonding.

Pulsed Heat Systems

Pulsed Heat Systems

Highly accurate computer-controlled heating solution for solder based applications. Available in several forms ranging from a large surface area model to accommodate all part sizes to a heating source incorporated into the tool itself for localized heating.

Bond Data Miner

Bond Data Miner

A comprehensive and centralized data management and analysis system that provides machine and process trend monitoring, storage and traceability of data across platforms, and closed loop process control for increased yields and predictive maintenance.

Dispensing Solutions

Dispensing Solutions

Dispensing solutions range from the highly consistent Musashi Jetter which is not only surface height and temperature independent but also the highest throughput option for small controlled dispensing and the perfect option for 5G applications to the precisely controlled Nordson Micro Dot time-pressure solution which is capable of dispensing all the way down to “0.006 diameter dots.

UV Systems

UV Systems

A wide variety of options for UV sources ranging from custom designed stages with mirrored surfaces and actuating covers for maximum UV exposure to head mounted UV sources with programmable intensities that can provide the perfect cure profile for the best results.

Identification Systems

Identification Systems

Seamless integration with all types of barcode scanners, from 2D to 3D, which can be mounted on the bond head or integrated within the workspace of our bonders. Characters on chips can even be read with the onboard vision system. All identification information is tracked and collected in a report for easy review.

Automated Handler System

Automated Handler System

Automated inline handlers and conveyor systems to seamlessly bring parts in and out of the workspace. Custom designed for all process to fit all components and even apply heat for bot die and wire applications. Built with integration in mind for fully automatic assembly lines that can include all of our bonders.

Automatic Epoxy Die Attach

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Pulse Heat Stage

Eutectic Die Attach: A Highly Reliable Solution for Advanced Materials and Automation Challenges

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COVID-19 and the Pre-existing Trends in Aerospace - Part 2

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Pressure-less Silver Sintering for RF Power Electronics, Part 1 of 4 (应用于射频功率器件的无压银烧结技术,第1篇,共4篇)

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COVID-19 and the Pre-existing Trends in Aerospace - Part 1

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Combining Bonder and Vacuum Reflow Technologies for High-Reliability Packaging – Case #2 Optical Transceivers

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