Die bonding (die attach) is the process of attaching a die (or chip) to a substrate, package, or another die. Palomar machines enable two levels of attachment: in situ eutectic die attach and epoxy die attach, and en masse void-free die attach.

Eutectic die attach is a highly controlled die attach process for high reliability, high-accuracy requirement devices. Void-free die attach assembly processes are used when heat must be transferred away from the die or other critical components to avoid thermal failure. Applications used for eutectic die attach include RF Power Amplifiers, Military Hybrids, MMICs, high power semiconductor modules, and laser pump diodes.

Epoxy die attach is the most commonly used die attach process due to price point and speed. Applications used for epoxy die attach include transistors, encapsulation of wire bonds, LED attachment, MCMs and hybrids.

8301-Three Quarter View-With Glass-SST

SST 8300 Series Automated Vacuum Pressure Soldering System

The new SST 8300 Series, consisting of single and triple chamber systems provides a highly reliable solder connection with a better than industry standard void rate – key to delivering high reliability power modules for automotive and commercial applications.

The power module market is actively seeking a flux-free solder process that achieves low void rates, which provide for higher reliability and longer life.

The SST 8300 Series Automated Vacuum Pressure Soldering System differs from current systems on the market by utilizing SST’s unique system of applying both vacuum and gas pressure for the soldering interface of key components inside a power module, especially for DBC-to-base plate soldering.

Expect Higher Standards! 
Things move fast in the optoelectronics market. Placement accuracy, high capacity and production speed matter more than ever. We’ve got the solution to keep up with the demands of your customers for accurate, consistent, throughput. Meet the 6532HP.

Developed for the demanding needs for the optoelectronics market, the 6532HP exceeds industry standards for placement accuracy and production speed. 1.5 micron placement accuracy and speeds up to 1200 UPH means maximum throughput for you and your customers. Automated presentation of dual 8” wafers, or up to 72 wafflepacks, or tape dispensers provides a high production, flexible parts presentation platform. The 6 position, bi-directional tool turret allows “on-the-fly” tool changes to maximize speed and flexibility. Options abound to customize your system to your needs.

Everything you need on a single system
A variety of options and variations adds flexibility to the 6532HP and allows you to package the widest range of optoelectronic devices on a single system.

6532HP Die Bonder