PTI Blog

“IMS is THE place to be for high reliability packaging!” was the IMS Insider tweet from Palomar Technologies—and a very true statement ...

Posted by Janine Powell on June 11

The increasingly densely populated and higher power levels of RF & Optoelectronic packages are creating unique challenges for assembly ...

Posted by Janine Powell on April 23

Throughout the history of electronics manufacturing, there have been distinct boundaries between those that assemble SMT components and ...

Posted by Palomar Technologies MarCom Team on October 9

As telecommunications and information processing have exploded over the several decades, the need for extremely accurate, high-yield ...

Posted by Palomar Technologies MarCom Team on August 21

With the ever-evolving trend for smaller applications, the capability to produce high-precision, high-reliability component bonding remains ...

Posted by Palomar Technologies MarCom Team on July 31

"Unleash the RF/Microwaves!" There was an a recent ad in the Microwave Journal that proclaimed this, but it could be the rallying cry at ...

Posted by Palomar Technologies MarCom Team on June 26

While 3D packaging and reliability was a reoccurring topic throughout the ECTC 2012 exhibit hall conversations, traditional 2D packaging ...

Posted by Palomar Technologies MarCom Team on June 5

New products, new materials and new approaches in the high-frequency electromagnetic spectrum seemed to be the common theme at the Feb 7-9 ...

Posted by Palomar Technologies MarCom Team on February 14

Although there is continued effort in the semiconductor packaging industry to reduce package size along with the never-ending pursuit of ...

Posted by Palomar Technologies MarCom Team on December 20

Manufacturers are constantly confronted with device integration challenges as consumers want electronics to be smaller, more easily ...

Posted by Palomar Technologies MarCom Team on September 30

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