Electronic Components and Technology Conference (ECTC)

3 d electronics chip stackingWhile 3D packaging and reliability was a reoccurring topic throughout the ECTC 2012 exhibit hall conversations, traditional 2D packaging truly dominated the conference. Our industry is always looking for innovative ways to shrink package sizes, increase capabilities and functionality, and reduce costs—all while continuing to leverage on well-understood traditional packaging practices.

The 62nd annual Electronic Components and Technology (ECTC) conference was held in San Diego, California, on May 29th through June 1st. This year attracted nearly 900 industry peers to the conference—to say the least, the exhibit hall was packed. Palomar Technologies was one of 81 exhibitors. Throughout the exhibit show floor, there was strong interest in traditional die attach and wire bonding. Emerging markets—like MEMS packaging, high-power LEDs, power amplifiers and computer and peripheral modules—were all in play at this growing trade show.

It was refreshing to see a balance between new and familiar faces at ECTC 2012. Over the years, many valuable and long-lasting business (and friendly) relationships have been built at conferences such as ECTC, but sometimes it can feel as though the same crowd attends time and time again. From a personal perspective, this can be a disturbing trend, as the industry needs a fresh group of people to continue to carry the flag for this important electronics component market. It was encouraging to see so many people attend and walk the exhibit hall. It is just as important to shake a hand for the first time as it is to shake another over a dozen times.

die bonder demonstrations die attachThe success of ECTC 2012 extended beyond the walls of the conference convention center. Palomar Technologies opened the opportunity for conference attendees to take advantage of our factory’s close proximity to the trade show by offering a guided tour of our clean rooms and to experience some live 3800 Die Bonder, 6500 Die Bonder and 8000 Wire Bonder demonstrations. Dozens of ECTC attendees were hosted at the Palomar Technologies headquarters and laboratory facility in Carlsbad, CA.

Missed out on our factory tours? No problem. Palomar Technologies continues to welcome those interested in in-person meetings, tours and bonder demonstrations. Please contact us and we would be happy to schedule a meeting in the near future.

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Bradley Benton
Regional Sales Manager, Western Americas
Palomar Technologies