Big ROI from Small Footprint Die Bonders

Clean room space is expensive. Obtaining the highest component placement accuracies and the versatility of high-precision application ...

Posted by Palomar Technologies MarCom Team on June 28

Automated Die Attach Systems Backed by Decades of Process Expertise

Through decades of experience with automatic, highly versatile and precise die attach systems, I have learned a few important lessons in ...

Posted by Palomar Technologies MarCom Team on June 19

Flux-Less Micro BGA Solder Reflow

Palomar Technologies Assembly Services (“Assembly Services”) offers unique assembly methods supporting flux-less Micro Ball Grid Array ...

Posted by Palomar Technologies MarCom Team on April 13

Improved Eutectic Die Attach with a Pulse Heat Stage…Some Like it Hot!

With the successful deployment of the Pulse Heat Stage (PHS) system from Palomar Technologies, our field sales and engineering teams often ...

Posted by Palomar Technologies MarCom Team on February 1

Automated Eutectic Die Attach for Device Thermal Management

Device thermal management has become more essential as packages run at higher frequencies and higher power levels. Designers are thinning ...

Posted by Palomar Technologies MarCom Team on January 15

TAB Bonding and Other Bonding Methods

Quick note: "Other" in the suject is referring to wire bonding and die attach, and the sub-sets that come with them, ie epoxy, eutectic, ...

Posted by Palomar Technologies MarCom Team on May 10

IMAPS 2009 San Jose - Review

IMAPS 2009 in San Jose was, as expected, slow due to current economic conditions. It was evident that reduced travel budgets and last ...

Posted by Palomar Technologies MarCom Team on November 17