Telecom & Datacom Automated Eutectic Die Attach

Today's telecommunications/datacom industry is coping with its own technical challenges in processing capabilities through the continuous ...

Posted by Palomar Technologies MarCom Team on March 6

Happy New Year from Palomar Technologies CEO

I would like to take a moment and thank you for your subscription to the PTI Blog. I hope you have found each weekly post both insightful ...

Posted by Palomar Technologies MarCom Team on December 27

5 Competencies for Automated Microelectronic Assembly Lines

Automated assembly lines aren’t a new concept. For some of us, the term conjures memories of pictures or videos shown in grade school about ...

Posted by Palomar Technologies MarCom Team on November 1

RF Packaging - Automation, Evolution and Trends

The objective of RF packaging—where RF (radio frequency) is the range of electromagnetic frequencies above the audio range and below ...

Posted by Palomar Technologies MarCom Team on September 6

Increased Efficiency & Traceability in Microelectronics Assembly

Consumers today are inundated with the concept of "paper-free." Magazines and newspapers are readily available on the Internet, online ...

Posted by Palomar Technologies MarCom Team on August 2

Automated Die Attach Systems Backed by Decades of Process Expertise

Through decades of experience with automatic, highly versatile and precise die attach systems, I have learned a few important lessons in ...

Posted by Palomar Technologies MarCom Team on June 19

TAB Bonding and Other Bonding Methods

Quick note: "Other" in the suject is referring to wire bonding and die attach, and the sub-sets that come with them, ie epoxy, eutectic, ...

Posted by Palomar Technologies MarCom Team on May 10

Lowest Cost Complex Microelectronic Packaging Case Study

This is Part 3 of our series on Manufacturing in North America. The following case study is an excellent example of North America's low ...

Posted by Palomar Technologies MarCom Team on April 23