Every year, International Microelectronics and Packaging Society (IMAPS) members are asked to select those who have done such notable work that they deserve the distinction of the Society’s awards to publicly acknowledge their accomplishments. Palomar Technologies’ Chief Technical Officer, Daniel Evans, was honored to have received the IMAPS “Fellow of the Society Award” at this year’s IMAPS Symposium in Orlando, Florida held October 26-29.
Recognition by the Selection Committee
In the opinion of the Fellow of the Society Award Selection Committee, the Fellow of the Society Award honors and recognizes those who “have made significant and continuing contributions to IMAPS over the years at any level—local or national”. The nominee must have been an IMAPS member for ten consecutive years.
About Daniel Evans
Daniel Evans began his career at Hughes Aircraft (now Palomar Technologies) as a Design Engineer in 1984 and later in several different key positions in R&D and Engineering. Mr. Evans developed many of the core technologies fundamental to Palomar Technologies’ automated equipment platforms; presently, these platforms are installed in thousands of machines around the world. Through this work, Mr. Evans received nine motion control and system patents. Additionally, he has published over 28 technical papers including the widely popular “AuSi and AuSn Eutectic Die Attach Case Studies.”
Throughout Mr. Evans' career at Palomar Technologies, he has worked in the 
positions of Design Engineer, Project Manager, Engineering Manager, VP of Engineering, Applications Manager, and now Chief Technology Officer. Mr. Evans’ experience in equipment design, customer application, and industry & customer roadmaps allows him to provide leadership of Palomar’s New Product Develop Committee. Palomar’s most recent products launched include the Model 9000 Wedge Bonder and Model 3880 High Precision Die Bonder.
Education and Credentials
Mr. Evans earned a B.S. Degree in Mechanical Engineering from Purdue University, a M.S. Degree in Mechanical Engineering from Stanford University (both degrees have an emphasis in Robotics and Controls), and a Certificate from the Executive Program for Scientists & Engineers at UCSD. He has served on the Advanced Packaging Roadmap Committees for iNEMI, IMAPS, and ITRS.
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Katie Finney
Marketing Specialist
Palomar Technologies, Inc.
