The increasingly densely populated and higher power levels of RF & Optoelectronic packages are creating unique challenges for assembly ...

Posted by Janine Powell on April 23

Gold (Au) ball wire bonding is still the predominate method for interconnects in microelectronics. Industries are further utilizing novel ...

Posted by Janine Powell on April 16

Today’s microelectronic manufacturing environments seem to be constantly changing. One day you are building up traditional “flat-land” ...

Posted by Janine Powell on April 9

Have you ever had an ink jet printer that no matter what you did to calibrate it, you still had a bit of a blur? How you must have cringed ...

Posted by Janine Powell on April 2

SEMICON China celebrated its 25th year, held this year at the Shanghai New International Expo Center on March 19-21. Mr. PH Chan, Palomar ...

Posted by Janine Powell on March 26

A consultant can be a very vital component on a company’s road to success. Bringing in a professional that provides expert advice in their ...

Posted by Janine Powell on March 12

[For the English version, click here.] ...

Posted by Janine Powell on March 5

Since it was started in 1951 by the National Society of Professional Engineers, National Engineers Week (NEW) is celebrated every third ...

Posted by Janine Powell on February 26

With the creeping rise in the price of gold, many microelectronics manufacturing companies have been looking for alternatives to reduce the ...

Posted by Janine Powell on February 5

Wire bond interconnects have traditionally been considered "forward" bonded wires. Forward bonding refers to bonding from an integrated ...

Posted by Janine Powell on January 22