Flip chip processes have been around for more than 40 years. Since then, thousands of applications have taken advantage of the size and ...

Posted by Janine Powell on July 23

[For the English version, click here.] Soldagem de fio de bola de ouro Ouro (Au) ainda é o método predominante para interconexões em ...

Posted by Janine Powell on July 16

Near-sourcing, out-sourcing, in-sourcing, crowd-sourcing, group-sourcing—which one is right for your organization? Palomar Technologies' ...

Posted by Janine Powell on July 2

SEMICON West 2013 is barely two weeks away; attendees are just days away from over 50 hours of technical programs and focused access to ...

Posted by Janine Powell on June 25

Handlers are bonder options that can bring great value and efficiency to your assembly process. For example, on the 8000 Wire Bonder, ...

Posted by Janine Powell on June 18

“IMS is THE place to be for high reliability packaging!” was the IMS Insider tweet from Palomar Technologies—and a very true statement ...

Posted by Janine Powell on June 11

According to a recent Business Insider report, there are over 1.5 billion people in the world today using a smartphone, so it is safe to ...

Posted by Janine Powell on May 21

Just as routine medical exams and checkups can help us live longer and healthier lives, routine checkups of bonders can extend the life of ...

Posted by Janine Powell on May 14

[For the English version, click here.] Gold (Au) Ball- Drahtbonden ist immer noch die beherrschende Verbindungsmethode in der ...

Posted by Janine Powell on May 7

Multi-Chip Module packaging is an important facet of modern electronic miniaturization and micro-electronic systems. Demand for further ...

Posted by Janine Powell on April 30