The importance of automobile maintenance and tune-up is analogous to wire and die bonder maintenance. Proper maintenance and tuning of your ...

Posted by Janine Powell on March 25

[For the English version, click here.] 虽然虽半导体封装行业继续不断努力，设法缩小产品的体积以及永无止境的追求成本的节约,但是仍然有相当数量的应用程序需要一套完全不同的贴片和键合功能。 ...

Posted by Janine Powell on March 11

Last week was the 15th anniversary of the Strategies in Light technical conference. Over 5,000 people attended the conference, and more ...

Posted by Janine Powell on March 4

Supply chain management is a critical link in operational efficiency and customer satisfaction. Palomar manufactures products in Singapore ...

Posted by Janine Powell on February 25

Often when companies are discussing potential projects, they are at a crossroads on the most economical way to proceed with a small ...

Posted by Janine Powell on February 18

Though the trend is moving away from gold wire for high-volume production wire bonding, gold ball wire bonding still makes up about 50 ...

Posted by Janine Powell on February 11

Much has been written about using Design of Experiments to optimize the input parameters to an automatic wire bonder in order identify the ...

Posted by Janine Powell on February 5

Y – Yield In order for LED manufacturers to stay competitive in this dynamic environment, they need to have a comprehensive in-line process ...

Posted by Janine Powell on January 29

Eutectic bonding of Au-backed MMIC (Monolithic Microwave Integrated Circuits) power amplifiers presents a unique challenge due to the thin, ...

Posted by Janine Powell on January 28

W – Wafer While the microelectronics industry is working hard to develop low-cost LED packaging methods—such as with thermally and ...

Posted by Janine Powell on January 22