Here is a quick refresher on epoxy die attach and Anisotropic Conductive Paste (ACP). Using a flexible die bonder with 3 channels of fluid ...

Posted by Janine Powell on September 23

There was a lot of buzz last week surrounding Apple’s announcement regarding new product releases and enhancements. With the release of the ...

Posted by Janine Powell on September 16

[For the English version, click here.] 超过5000人参加了最近战略光技术的15周年会议，超过200家公司展出- 包括了Palomar Technologies ...

Posted by Janine Powell on September 9

What is the purpose of an effective bonder training program? Bonder training is vital to the efficiency and success of an engineer’s ...

Posted by Janine Powell on August 26

A short case study in the shift from manual to automation is a good reminder of where we came from and where we are going in technology. It ...

Posted by Janine Powell on August 19

In light of the recent steps toward congressional endorsement of optics and photonics as a vital enabling technology for the economy (pun ...

Posted by Janine Powell on August 12

Process is critical. Working with a team who can deliver process expertise and world-class equipment will offer many more choices and a ...

Posted by Janine Powell on August 5

Microelectronic programs come with many forms of risk. If the design is manufacturable, the list is reduced, but a number of items still ...

Posted by Janine Powell on July 22

[For the English version, click here.] Cela nous est tous arrivez un jour : Votre micro-câbleuse fonctionne parfaitement et la production ...

Posted by Janine Powell on July 8

For many years, wire bonding has been the most robust and commonly used method for chip-to-die interconnection of lead-frame, integrated ...

Posted by Janine Powell on June 24