Automated Dispense Systems

MAX Series - Non-heated
The MAX Series dispense system is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED Encapsulation, and Masks, to name a few. The MAX Series is available, depending on your production requirements, in either a standalone or inline configuration.

MAX II heated fluid dispense machine

MAX II Series - Heated
The 'II' signifies heat capability in the work area, an optional nozzle, and material heat. MAX II system is available in either stand-alone or inline configurations.

Substrate Heating Methods:

  • Convection/Forced Air - heat is transferred to the product via an air stream from below the board. This method is preferred when the bottom side of the product has features that are difficult to compensate for with contact fixturing.
  • Contact - Heat is rapidly transferred to the product through direct contact with the product. In most cases, the fixture incorporates vacuum to pull the product to the heated surface for uniform heat transfer.
GPD MAX Series Data Sheets

Precision Pump Technology

Micro-Dot: small precision dispensing
An Auger based pump with precision motion control and machining to dispense the smallest volumes of fluid with ease. Suitable for pastes and adhesives.

PCD: continuously volumetric
Proprietary progressive cavity dispense pump for continuously volumetric dispensing. Outstanding capabilities for low-to-mid/high viscosity fluids. No drip or drool and repeatable results over the entire pot life of the fluid.

HyFlo: high-volume flow
An auger based pump with the design criteria of accurately moving larges volumes of fluid at a high rate of speed. Especially well suited for abrasive fluids.

  GPD Continuous Volumetic Technology