The SST 8300 Series is an automated vacuum pressure soldering system designed to deliver a reliable low-void, flux-less solder process using precise combination of vacuum and gas pressure. Featuring conveyor belts and a Cartesian gantry, the system provides high volume, high reliable packages through precise control of the soldering process. Available with a single or triple chamber, the system allows for heating up to 500°C and fast cooling in an inert gas environment from vacuum levels below 50 millitorr to pressures up to 40 psig using the QuikCool™ cooling unit.
Key benefits of the 8300 Series include:
User-Friendly, Power Software
The 8300 Series includes a clean, user-friendly software interface making it easy for both programmers and operators. Plus the Data Log Analyzer provides a graphic review of data for real-time process analysis.
The SST 8300 Series Automated Vacuum Pressure System can operate as a stand-alone unit or can be integrated into an automated production line. A Cartesian gantry system is used to automatically shuttle part carriers in/out of each chamber, performing each movement with high accuracy and precision.
Chamber with Edge Heating
Unique edge heating elements enable the chamber to achieve temperature uniformity over the entire target plate.
Void-Free Die Soldering. Void-free die and substrate solder attach is used to create a uniform thermal interface for high-reliability power modules.
Hermetic Package Sealing. Hermetic package sealing uses solder or glass to create a barrier to moisture which will damage sensitive electrical circuit components.