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8300 Series Automated Vacuum Pressure

Overview

The SST 8300 Series is an automated vacuum pressure soldering system designed to deliver a reliable low-void, flux-less solder process using precise combination of vacuum and gas pressure.  Featuring conveyor belts and a Cartesian gantry, the system provides high volume, high reliable packages through precise control of the soldering process. Available with a single or triple chamber, the system allows for heating up to 500°C and fast cooling in an inert gas environment from vacuum levels below 50 millitorr to pressures up to 40 psig using the QuikCool™ cooling unit.

Key benefits of the 8300 Series include:

  • Automated high-volume production vacuum pressure soldering system
  • Enables low-void solder connections with preforms or with solder paste
  • Offers maximum flexibility for processing a wide range of solder alloys and other alternative interconnect materials
  • Each chamber of the SST 8303 runs a complete process allowing multiple processes to be run in parallel
  • Flexible configuration for any production line: single (8301) or triple (8303) chamber
  • Oxide removal technology using formic acid or forming gas
SST 8303
8300 software interface

User-Friendly, Power Software

The 8300 Series includes a clean, user-friendly software interface making it easy for both programmers and operators. Plus the Data Log Analyzer provides a graphic review of data for real-time process analysis.

Automation Robot

The SST 8300 Series Automated Vacuum Pressure System can operate as a stand-alone unit or can be integrated into an automated production line. A Cartesian gantry system is used to automatically shuttle part carriers in/out of each chamber, performing each movement with high accuracy and precision.

8301 Front View with Robot Picking Up the Plate
8301 Oven open with plates inside

Chamber with Edge Heating

Unique edge heating elements enable the chamber to achieve temperature uniformity over the entire target plate.

Processes

Void-Free Die Soldering. Void-free die and substrate solder attach is used to create a uniform thermal interface for high-reliability power modules.

Hermetic Package Sealing. Hermetic package sealing uses solder or glass to create a barrier to moisture which will damage sensitive electrical circuit components.

Selected Options

  • Formic Acid
  • Flux Trap
  • Moisture Analyzer
  • Oxygen Analyzer
  • Up to 6 Monitoring Thermocouples
  • Water Chillers
  • Dry Vacuum Pump
  • Mid-Vac 10-5 torr

Applications

  • Power Module Assembly
  • IGBT/SiC/GaAs/GaN Die Attach
  • Die Attach for Pressure Sensors
  • Hermetic Sealing of IR Image Sensors
  • High Power Laser Module Assembly
  • Multilayer Ceramic Capacitors
  • High Intensity LED Attach
  • CPV Solar Cell Assembly
  • Hermetic Sealing of Hi-Rel Packages
  • Copper Clip Soldering

Download the 8301 Data Sheet

8301 Automated Vacuum Pressure Soldering System, sst vacuum reflow systems

Download the 8303 Data Sheet

8303 Automated Vacuum Pressure Soldering System, sst vacuum reflow systems
Graphite, ceramic, and metal fixtures are required for most microelectronic assembly processes. Learn more about tooling.
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Other Resources
5100 Vacuum Pressure Furnace Data Sheet
3130 Vacuum Pressure Furnace Data Sheet
1500 Wafer Aligner Data Sheet
3250 High Vacuum Wafer Furnace