8000i Wire/Ball Bonder

The Palomar 8000i Wire Bonder is a fully automated thermosonic high-speed, ball-and-stitch wire bonder capable of ball bumping, stud bumping, wafer bumping, chip bumping, and customized looping profiles. Well suited for many aspects of packaging and component assembly, including complex hybrids, MCMs, and high-reliability devices.

Category Palomar Wire & Wedge Bonders Processes

Ball Bumping, Gold Wire Bonding

Applications
  • Large complex hybrids 
  • HB/HP LED arrays
  • Optoelectronic packaging
  • Chip-on-board (COB)
  • System in packages (SiPs)
  • Specialty lead frames
  • Automotive assemblies
  • Flex circuits
  • Multi-chip modules (MCMs)
  • Fine pitch devices
  • LEDs with running stitch
8000i Wire Bonder - high-reliability wire bonder & ball (stud) bumper
VisionPilot

VisionPilot®

Utilizes advanced geometric pattern matching technology to reliably and accurately locate parts that are randomly oriented or have greyscale variations by using a set of boundary curves that are not tied to a traditional pixel-grid. Maximizes throughput, and enables part inspection both before and after bonding.

Bond Data Miner

Bond Data Miner

A comprehensive and centralized data management and analysis system that provides machine and process trend monitoring, storage and traceability of data across platforms, and closed loop process control for increased yields and predictive maintenance.

Intelligent Interactive Graphical Interface

Intelligent Interactive Graphical Interface® - i2Gi®

Supports advanced wire bond control through an intuitive interface that simplifies programming and provides real time graphical feedback to the user of bonding performance. Allows for a connected view with the ability to overlay 1:1 scaled graphics on top of live video of actual part.

Automated Handler System

Automated Handler System

Automated inline handlers and conveyor systems to seamlessly bring parts in and out of the workspace. Custom designed for all process to fit all components and even apply heat for bot die and wire applications. Built with integration in mind for fully automatic assembly lines that can include all of our bonders.

Vision Standardization

Vision Standardization

Automated calibration of image lighting across multiple bonders. Allows for seamless transfer of programs from bonder to bonder with zero time spent re teaching or adjusting references. Greatly reduces downtime when programs need to be updated and distributed across bonders.

Forecasting the 2020 Micro-Optoelectronics Business During COVID-19

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Combining Bonder and Vacuum Reflow Technologies for High-Reliability Packaging

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Rapid Deployment of Photonic Chip Packages: From Prototype to Production using Outsourced Manufacturing

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Manual Load, Island of Automation, or In-Line: What is the Right Solution for my Process?

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Ball and Wedge Bonders & Loop Mode Development

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Vacuum vs. Mechanical Clamping: Which is Best?

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