3880-II Die Bonder
3880-II Die Bonder
A solid investment for maximizing productivity – from R&D to volume, automated bonding – all in one bonder. The new Palomar 3880-II die bonder is based on Palomar’s proven die bonder design but includes options to even further maximize productivity, reduce programming time by up to 95%, and improve the overall bonder productivity. The highly flexible Palomar 3880-II is ideally suited for a range of markets and applications.
VisionPilot® with Vision Standardization
Utilizes advanced geometric pattern matching technology to reliably and accurately locate parts that are randomly oriented or have greyscale variations by using a set of boundary curves that are not tied to a traditional pixel-grid. Vision Standardization ensure consistency across systems and throughout the lifetime of the machine; reducing process maintenance and maximizing production.
Automated Tool Changer
Automated access to nearly unlimited tools. Enables use of as many tools as needed for any process. Keep up to 8 tools loaded in the tool turret for near-instant access. Keep back-ups of tools on hand for rapid changing when current tools wear out.
A comprehensive and centralized data management and analysis system that provides machine and process trend monitoring, storage and traceability of data across platforms, and closed loop process control for increased yields and predictive maintenance.
High Force Tool Option
Reach high levels of force while maintaining high precision for low force operations. Tight planarity control even for extremely large components. Can automatically change tools while handling unique and oversized tools with ease at the high force position.
Highly accurate computer-controlled heating solution for solder based applications. Available in several forms ranging from a large surface area model to accommodate all part sizes to a heating source incorporated into the tool itself for localized heating.
Dispensing solutions range from the highly consistent Musashi Jetter which is not only surface height and temperature independent but also the highest throughput option for small controlled dispensing and the perfect option for 5G applications to the precisely controlled Nordson Micro Dot time-pressure solution which is capable of dispensing all the way down to “0.006 diameter dots.
Automated Handler System
Automated inline handlers and conveyor systems to seamlessly bring parts in and out of the workspace. Custom designed for all process to fit all components and even apply heat for bot die and wire applications. Built with integration in mind for fully automatic assembly lines that can include all of our bonders.
A wide variety of options for UV sources ranging from custom designed stages with mirrored surfaces and actuating covers for maximum UV exposure to head mounted UV sources with programmable intensities that can provide the perfect cure profile for the best results.
Seamless integration with all types of barcode scanners, from 2D to 3D, which can be mounted on the bond head or integrated within the workspace of our bonders. Characters on chips can even be read with the onboard vision system. All identification information is tracked and collected in a report for easy review.
Epoxy Stamp Station
Designed to be simple and quick to maintain while supporting high repeatability daubing. Perform rapid cleaning in seconds due to quick release of blade and epoxy well. The repeatability and sturdiness of the design means greater consistency of daubing – both during production and between setups. Designed to inhibit overflow and conserve material use.
Process Control Techniques for Manufacturing RF Power Amplifier Assemblies
Developments in Undersea Fiber Optics and Packaging – 2022 and Beyond
6G Communications: A Truly Quantum Leap
Packaging Technologies meet Quantum Opportunities – Part Three
Efficient Manufacture of IR Sensors
Logistic Sensor Packaging – Part 3: Overcoming Assembly Challenges of Sensor Semiconductors
Contact us below and a representative will be in touch to help you with your die bond needs.