About

Palomar® Technologies is a leading supplier of automated microelectronic assembly machines and contract assembly services with specialization in precision die attach, wire bonding and vacuum reflow solutions. We are proudly an independent USA-based company, owned and operated by local management.

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Applications

Palomar® Technologies provides interconnect solutions for a wide variety of industries and applications. With 45+ years supporting the semiconductor and photonics industries, we have expanded across automotive (LiDAR & power modules), medical, microwave, RF/wireless, Datacom, telecom and a few niche markets.

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Overview


Innovation Centers

Palomar® Technologies Innovation Centers are full-service advanced packaging laboratories offering solutions for process development, package prototyping, die attach, wire bonding, vacuum reflow, outsourced package assembly, test, and measurement.

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Get access to our entire knowledge database: read blog articles and download materials.

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Contact Us

Contact Palomar® Technologies for more information about our Total Process Solution including Palomar die bonders, Palomar wire and wedge bonders, SST vacuum reflow systems, along with Innovation Centers for outsourced manufacturing and assembly.

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Press Release

Palomar Technologies/SST Vacuum Reflow Systems offers Webinar on Solving Power Module Failure Modes using Low-Void Solutions

Posted by Palomar Technologies MarCom Team on Thu, Feb 25, 2021 @ 04:00 PM

Carlsbad, CA – February 25, 2021 Palomar Technologies, a global leader in delivering total process solutions for advanced photonics and microelectronic device packaging, announced today that SST Vacuum Reflow Systems, a Palomar Solution company is offering a webinar on the typical power module failure modes and how to solve them.

Power Modules is a rapidly growing segment with high-growth applications ranging from electric vehicles, high-speed rail, and large medical devices.powermodule- 1200x900 However, the stack of interconnects in power modules are the source of mechanical failures. Removal of heat between the DBC and baseplate is often the main source of thermal mismatches, making voids in this joint the most pressing challenge for power module manufacturers.

SST Vacuum Reflow Systems' Alex Voronel will lead the presentation that will take viewers through the challenges facing the IGBT Power Module device manufacturers outlining the typical failure modes and how to solve them. SST offers a flux-less soldering process resulting in less than 1% voiding using a reliable Formic Acid or Forming Gas option process to improve time to market.

The webinar will take place on March 3, 2021 at 8am PST. Attendees can register for the webinar here: https://attendee.gotowebinar.com/register/8744881480473843728.

About Palomar Technologies
Palomar Technologies makes the connected world possible by delivering a Total Process Solution™ for advanced photonic and microelectronic device assembly processes utilized in today’s smart, connected devices. With a focus on flexibility, speed and accuracy, Palomar’s Total Process Solution includes Palomar die bonders, Palomar wire and wedge bonders, SST vacuum reflow systems, along with Innovation Centers for outsourced manufacturing and assembly, and Customer Support services, that together deliver improved quality and yield, reduced assembly times, and rapid ROI.

With its deep industry expertise, Palomar equips customers to become leaders in the development of complex, digital technologies that are the foundation of the connected world and the transmission of data generated by billions of connected devices. Palomar solutions are utilized by the world’s leading companies providing solutions for datacom, 5G, electric vehicle power modules, autonomous vehicles/LiDAR, enhanced mobile broadband, Internet of Things, SMART technology, and mission-critical services.

Headquartered in Carlsbad, California, Palomar offers global sales, service and application support from its offices in the USA, Germany, Singapore, and China. For more information, visit: http://www.palomartechnologies.com.

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Media Contact:
Rebecca Janzon
Director of Marketing Communications
Email: rjanzon@bonders.com
Mobile: 760-409-7453