Customer demands increase for die attach and wire bonding equipment to manufacture 5G and respirator/ventilator components
Carlsbad, CA – April 22, 2020 – Palomar Technologies, a global leader in total process solutions for advanced photonics and microelectronic device packaging announced since January, they have seen an increase in requests from customers manufacturing critical components needed to address the COVID-19 crisis.
“We see an acceleration of orders of our 3880 Die Bonder to support, among other things, the expansion of the 5G infrastructure. Many of our customers are supporting unprecedented demand for wireless communications and networking bandwidth, remote medicine, IoT in robotics, and the use of video conferencing. This has contributed to a surge in internet and wireless traffic globally," said Rich Hueners, Vice President of Sales and Marketing for Palomar Technologies. “Our solution supports RF GaN using Pressure-less silver sintering and the capability for AuSn/AuSi die attach on a single machine. Within the medical device market, our customers are rapidly ramping up the production of pressure sensors, which are crucial components used in respirators and ventilators, and this has resulted in a surge of orders for our 8000i Wire Bonder.”
The Palomar Innovation Center, which specializes in contract assembly and process development, has also seen customer demand grow substantially over the past few months in these same areas.
Palomar Technologies recently completed the move into its new corporate headquarters. This move includes expanding manufacturing facilities and engineering laboratories, class ISO Class 6 & 7 (Fed STD Class 1,000 - 10,000) cleanroom/laboratory, state-of-the-art production laboratories, along with contract manufacturing/process development (Innovation Center) and office space.
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| Figure 1 Palomar 3880 Die Bonder | Figure 2 Palomar Innovation Center - Carlsbad, CA |
About Palomar Technologies
Palomar Technologies makes the connected world possible by delivering a Total Process Solution™ for advanced photonic and microelectronic device assembly processes utilized in today’s smart, connected devices. With a focus on flexibility, speed and accuracy, Palomar’s Total Process Solution includes Palomar die bonders, Palomar wire and wedge bonders, SST vacuum reflow systems, along with Innovation Centers for outsourced manufacturing and assembly, and Customer Support services, that together deliver improved product quality and yield, reduced assembly times, and rapid ROI.
With its deep industry expertise, Palomar equips customers to become leaders in the development of complex, digital technologies that are the foundation of the connected world and the transmission of data generated by billions of connected devices. Palomar solutions are utilized by the world’s leading companies providing solutions for datacom, 5G, electric vehicle power modules, autonomous vehicles/LiDAR, enhanced mobile broadband, Internet of Things, SMART technology, and mission-critical services.
Headquartered in Carlsbad, California, Palomar offers global sales, service and application support from its offices in the USA, Germany, Singapore and, China. For more information, visit: http://www.palomartechnologies.com.
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Media Contact:
Rebecca Janzon
Director of Marketing Communications
Email: rjanzon@bonders.com
Mobile: 760-409-7453