Free Webinar: February 23, 2022, at 8 am PST
Carlsbad, CA – February 10, 2022 – Palomar Technologies, a global leader in delivering total process solutions for advanced photonics and microelectronic device packaging, announced today they are offering a webinar discussing the differences between ball bonding and wedge bonding.
In today’s world of semiconductor packaging, over 85% of packages have some form of wire or wedge bond, be it ball bonding, wedge bonding, flip-chip or chip attach. Of those, ball bonding is substantially more frequently used than any other package interconnect method. But, why would a process engineer choose a wedge bonder over a ball bonder or vice versa as they are so closely related?
This has been the question of most process engineers because, generally speaking, the electrical characteristics of the semiconductor package are affected by the method of wire bonding. However, there are cases where certain packages have physical constraints such as temperature limitation (low heat or no heat applications), such as the use of aluminum wire instead of gold, use of ribbon instead of wire and fine pitch application. Knowing which bonding method to choose is important to a successful package.
This free webinar, “The Great Debate: Ball Bonding vs Wedge Bonding”, will cover the applications for ball bonding and wedge bonding and what requirements need to be met for a successful bond.
The webinar takes place on February 23 at 8 am PST. Registration is through the link below:
https://www.palomartechnologies.com/the-great-debate-ball-vs-wedge-bonding-webinar
About Palomar Technologies
Palomar Technologies makes the connected world possible by delivering a Total Process Solution™ for advanced photonic and microelectronic device assembly processes utilized in today’s smart, connected devices. With a focus on flexibility, speed and accuracy, Palomar’s Total Process Solution includes Palomar die bonders, Palomar wire and wedge bonders, SST vacuum reflow systems, along with Innovation Centers for outsourced manufacturing and assembly, and Customer Support services, that together deliver improved quality and yield, reduced assembly times, and rapid ROI.
With its deep industry expertise, Palomar equips customers to become leaders in the development of complex, digital technologies that are the foundation of the connected world and the transmission of data generated by billions of connected devices. Palomar solutions are utilized by the world’s leading companies providing solutions for datacom, 5G, electric vehicle power modules, autonomous vehicles/LiDAR, enhanced mobile broadband, Internet of Things, SMART technology, and mission-critical services.
Headquartered in Carlsbad, California, Palomar offers global sales, service and application support from its offices in the USA, Germany, Singapore, and China. For more information, visit: http://www.palomartechnologies.com
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Media Contact:
Rebecca Janzon
Director of Marketing Communications
Email: rjanzon@bonders.com
Mobile: 760-409-7453