Free Webinar: April 13, 2022, at 8 am PST
Carlsbad, CA – March 23, 2022 – Palomar Technologies, a global leader in delivering total process solutions for advanced photonics and microelectronic device packaging, announced today they are offering a webinar which presents the key factors to achieving successful void-free die attach using a vacuum reflow system.
There are many factors to consider when it comes to achieving desirable die attach and lid seal bonding; one of the most important of these factors is solder interface voiding. Voids in the solder interface contribute to various failure modes including overheating via non-uniform dissipation of heat and high mechanical stresses. Vacuum reflow systems offer solutions to achieve low solder interface voiding through chamber pressure manipulations and surface treatment options. In addition, the correct solder material selection is key in achieving excellent bond quality. Each application is unique and requires careful consideration when it comes to solder material selection.
In this free webinar proper material, solder, and process/tooling selection will be explored to provide a successful void-free die attach using a vacuum reflow system. In addition, several case studies will be presented to demonstrate how proper selections make a difference.
The webinar takes place on April 13 at 8 am PST. Registration is through the link below:
About Palomar Technologies
Palomar Technologies makes the connected world possible by delivering a Total Process Solution™ for advanced photonic and microelectronic device assembly processes utilized in today’s smart, connected devices. With a focus on flexibility, speed and accuracy, Palomar’s Total Process Solution includes Palomar die bonders, Palomar wire and wedge bonders, SST vacuum reflow systems, along with Innovation Centers for outsourced manufacturing and assembly, and Customer Support services, that together deliver improved quality and yield, reduced assembly times, and rapid ROI.
With its deep industry expertise, Palomar equips customers to become leaders in the development of complex, digital technologies that are the foundation of the connected world and the transmission of data generated by billions of connected devices. Palomar solutions are utilized by the world’s leading companies providing solutions for datacom, 5G, electric vehicle power modules, autonomous vehicles/LiDAR, enhanced mobile broadband, Internet of Things, SMART technology, and mission-critical services.
Headquartered in Carlsbad, California, Palomar offers global sales, service and application support from its offices in the USA, Germany, Singapore, and China. For more information, visit: http://www.palomartechnologies.com
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Media Contact:
Rebecca Janzon
Director of Marketing Communications
Email: rjanzon@bonders.com
Mobile: 760-409-7453
