Press Release

Palomar Presenting on Energy & Eco-Sustainability using Pressure-Less Silver Sintering for RF Power Electronics

Posted by Rebecca Janzon on Fri, Sep 06, 2019 @ 02:53 PM

Carlsbad, CA – September 10, 2019 – Palomar Technologies, a global leader in total process solutions for advanced photonics and microelectronic device packaging, announced today that Evan Hueners, Product Marketing Manager for Palomar Technologies will be presenting Palomar’s solution for pressure silver sintering at the iMAPS 2019 Conference in Boston, MA, USA held from September 30 – October 2, 2019.

Energy & Eco-Sustainability using Pressure-Less Silver Sintering for RF Power Electronics

Evan Hueners, Product Marketing Manager for Palomar TechnologiesEvan photon-2-cropped

Silver sintering technology has been around since the 1980s, but the application has been previously restricted on account of numerous problems associated with its use. New materials, shifting demand, evolving technologies, issues of energy and eco- sustainability, together with lead-free requirements, have led many to revisit these challenges. In the past two years Palomar has undertaken a number of projects to explore various potential solutions. This paper pays special reference to Palomar’s work on packaging and assembly die attach using pressure-less silver sintering die attach at high temperature (>300C) with a view to its application in RF power electronics, and more especially in 5G wireless, automotive sensors and solid state cooking. As areas of significant future demand, the effectiveness, consistency and reliability of the solutions we have identified are underscored by their packaging ease and performance superiority.

Palomar Technologies is exhibiting at:

  • ECOC in Dublin, Ireland from September 23 – 25 and will be located in booth 27
  • Automotive LiDAR in Detroit, MI from Septembert 25 – 26 in booth 14
  • iMAPS Boston in Boston, MA from September 30 – October 2 in booth 212.

About Palomar Technologies
Palomar Technologies makes the connected world possible by delivering a Total Process Solution™ for advanced photonic and microelectronic device assembly processes utilized in today’s smart, connected devices. With a focus on flexibility, speed and accuracy, Palomar’s Total Process Solution includes Palomar die bonders, Palomar wire and wedge bonders, SST vacuum reflow systems, along with Innovation Centers for outsourced manufacturing and assembly, and Customer Support services, that together deliver improved production quality and yield, reduced assembly times, and rapid ROI.

With its deep industry expertise, Palomar equips customers to become leaders in the development of complex, digital technologies that are the foundation of the connected world and the transmission of data generated by billions of connected devices. Palomar solutions are utilized by the world’s leading companies providing solutions for datacom, 5G, electric vehicle power modules, autonomous vehicles/LiDAR, enhanced mobile broadband, Internet of Things, SMART technology, and mission critical services.

Headquartered in Carlsbad, California, Palomar offers global sales, service and application support from its offices in the USA, Germany, Singapore and China. For more information, visit: http://www.palomartechnologies.com

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Media Contact:

Rebecca Janzon

Director of Marketing Communications

Email: rjanzon@bonders.com

Mobile: 760-409-7453