About

Palomar® Technologies is a leading supplier of automated microelectronic assembly machines and contract assembly services with specialization in precision die attach, wire bonding and vacuum reflow solutions. We are proudly an independent USA-based company, owned and operated by local management.

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Applications

Palomar® Technologies provides interconnect solutions for a wide variety of industries and applications. With 45+ years supporting the semiconductor and photonics industries, we have expanded across automotive (LiDAR & power modules), medical, microwave, RF/wireless, Datacom, telecom and a few niche markets.

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Overview


Innovation Centers

Palomar® Technologies Innovation Centers are full-service advanced packaging laboratories offering solutions for process development, package prototyping, die attach, wire bonding, vacuum reflow, outsourced package assembly, test, and measurement.

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Resources

Get access to our entire knowledge database: read blog articles and download materials.

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Contact Us

Contact Palomar® Technologies for more information about our Total Process Solution including Palomar die bonders, Palomar wire and wedge bonders, SST vacuum reflow systems, along with Innovation Centers for outsourced manufacturing and assembly.

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Press Release

Palomar Presenting Low Latency Manufacturing for LiDAR at Automotive LiDAR 2019 Conference

Posted by Rebecca Janzon on Mon, Sep 09, 2019 @ 03:34 PM

Carlsbad, CA – September 9, 2019 – Palomar Technologies, a global leader in total process solutions for advanced photonics and microelectronic device packaging, announced today that Nicolas Evans, Sr. Process Engineer at Palomar Technologies Innovation Center | USA will be presenting at the Automotive LiDAR 2019 Conference in Detroit, MI, USA held on September 25 & 26, 2019.

Low Latency Manufacturing for LiDAR

Nicolas Evans, Sr. Process Engineer at Palomar Technologies Innovation Center | USANicholas Evans_Head Shot

Low latency manufacturing utilizes collaboration between LiDAR developers and photonics device manufacturers during the commercialization phase, allowing for greater agility and responsiveness, shortened time to market and reduced costs. This presentation will explore how low latency successfully bridges the gaps in manufacturing experience that often lead to late deliveries, high rejection rates of components, or increased costs due to design failures.

Palomar Technologies is exhibiting at:

  • Automotive LiDAR in booth 14.
  • ECOC in Dublin, Ireland from September 23 – 25 and will be located in booth 27
  • iMAPS Boston in Boston, MA from September 30 – October 2 in booth 212.

 

About Palomar Technologies
Palomar Technologies makes the connected world possible by delivering a Total Process Solution™ for advanced photonic and microelectronic device assembly processes utilized in today’s smart, connected devices. With a focus on flexibility, speed and accuracy, Palomar’s Total Process Solution includes Palomar die bonders, Palomar wire and wedge bonders, SST vacuum reflow systems, along with Innovation Centers for outsourced manufacturing and assembly, and Customer Support services, that together deliver improved production quality and yield, reduced assembly times, and rapid ROI.

With its deep industry expertise, Palomar equips customers to become leaders in the development of complex, digital technologies that are the foundation of the connected world and the transmission of data generated by billions of connected devices. Palomar solutions are utilized by the world’s leading companies providing solutions for datacom, 5G, electric vehicle power modules, autonomous vehicles/LiDAR, enhanced mobile broadband, Internet of Things, SMART technology, and mission critical services.

Headquartered in Carlsbad, California, Palomar offers global sales, service and application support from its offices in the USA, Germany, Singapore and China. For more information, visit: http://www.palomartechnologies.com

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Media Contact:

Rebecca Janzon, Director of Marketing Communications

Email: rjanzon@bonders.com

Mobile: 760-409-7453