Why or When One Should Use a Vacuum/Pressure Reflow Oven System as Opposed to Other Packaging Technology Systems ...
[View the blog in English here.] 今天, 绝大部分的高生产焊接电子元器件应用都 使用带式焊炉。带式焊炉的典型长度超过20英尺。这些高批量生产流程需要 <200 ppm 氧气水平, 氮气冲洗 (以达到如此低的 ppm 氧气水平) 和恒定的 ...
Posted by Janine Powell on