PTI Blog

“If you are creating high value hermetically sealed devices, what are the consequences of experiencing high voids in the package seal ...

Posted by Katie Finney on June 21

[View the blog in English here.] 今天, 绝大部分的高生产焊接电子元器件应用都使用带式焊炉。带式焊炉的典型长度超过20英尺。这些高批量生产流程需要 <200 ppm 氧气水平, 氮气冲洗 (以达到如此低的 ppm 氧气水平) 和恒定的 ...

Posted by Janine Powell on May 30

MEMS technology is everywhere we look. The Biotech, Medical Device, Communications and Inertial Sensing segments are increasingly using ...

Posted by Julia Picarelli on May 5

Today, in the majority of high production soldering of electronic component applications, belt furnaces are used. The typical length of a ...

Posted by Julia Picarelli on April 21

SST Vacuum Reflow Systems designs and builds systems and processes that achieve low to void-free seals for die attach component parts. ...

Posted by Katie Finney on February 28

[For the English version, click here.] 液体助焊剂（酸性底或无机底）传统上的主要用途是使氧化的金属表面产生高质量的焊料润, 导致金属零件之间更有效的焊接。然而，使用助焊剂同时也对焊接造成重大的缺陷。缺陷#1︰ ...

Posted by Janine Powell on February 21

Selecting the right solder alloy for your application is crucial to the success of the project. If the right solder alloy is not selected ...

Posted by Janine Powell on January 24

Liquid flux (acidic base or inorganic based) has traditionally been the primary solution to allow soldering of metal parts with surface ...

Posted by Janine Powell on January 10

[Read the English version of the blog here.] SST Vacuum Reflow Systems ...

Posted by Janine Powell on December 6

There are literally hundreds of solder alloys available from very low melting points from 38°C to extremely high brazing melting points to ...

Posted by Janine Powell on November 22

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