PTI Blog

Last month, we announced the latest addition to the Palomar suite of die attach and wire bonding solutions. This new machine is called the ...

Posted by Katie Finney on October 20

A short case study in the shift from manual to automation is a good reminder of where we came from and where we are going in technology. It ...

Posted by Janine Powell on August 19

In light of the recent steps toward congressional endorsement of optics and photonics as a vital enabling technology for the economy (pun ...

Posted by Janine Powell on August 12

The increasingly densely populated and higher power levels of RF & Optoelectronic packages are creating unique challenges for assembly ...

Posted by Janine Powell on April 23

Why is high accuracy required? And why is high accuracy important? In the context of bonding directly to wafer, +/- 1.5um allows for ...

Posted by Palomar Technologies MarCom Team on March 19

Although there is continued effort in the semiconductor packaging industry to reduce package size along with the never-ending pursuit of ...

Posted by Palomar Technologies MarCom Team on December 20

Since the early 1990s, halogen or xenon HID (high intensity discharge) lamps have been the most widely chosen light source in motor vehicle ...

Posted by on December 6

Clean room space is expensive. Obtaining the highest component placement accuracies and the versatility of high-precision application ...

Posted by Palomar Technologies MarCom Team on June 28

Applications requiring ultra-high-placement accuracies of 1μm to 3μm are resurfacing in several optoelectronic applications such as Arrayed ...

Posted by Palomar Technologies MarCom Team on April 28

The semiconductor market has been increasingly expanding in the Asia region—particularity in China—for producers and among consumers. In ...

Posted by Palomar Technologies MarCom Team on April 4

Prev 1 2 Next