Palomar® Technologies is a leading supplier of automated microelectronic assembly machines and contract assembly services with specialization in precision die attach, wire bonding and vacuum reflow solutions. We are proudly an independent USA-based company, owned and operated by local management.

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Palomar® Technologies provides interconnect solutions for a wide variety of industries and applications. With 45+ years supporting the semiconductor and photonics industries, we have expanded across automotive (LiDAR & power modules), medical, microwave, RF/wireless, Datacom, telecom and a few niche markets.

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Innovation Centers

Palomar® Technologies Innovation Centers are full-service advanced packaging laboratories offering solutions for process development, package prototyping, die attach, wire bonding, vacuum reflow, outsourced package assembly, test, and measurement.

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Contact us for more info about our Total Process Solution including die bonders, wire and wedge bonders, SST vacuum reflow systems, and Innovation Centers.

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PTI Blog

[For the English version, click here.] 虽然虽半导体封装行业继续不断努力,设法缩小产品的体积以及永无止境的追求成本的节约,但是仍然有相当数量的应用程序需要一套完全不同的贴片和键合功能。
Posted by Janine Powell on Tue, Mar 11, 2014 @ 02:16 PM
Returning to our series on everything LEDs, we will pick back up at letters “S” and “T” with substrates and thermal/temperature sensitive. S – Substrates The main substrates utilized in the production of LEDs are sapphire, gallium arsenide, or
Posted by Janine Powell on Wed, Jan 08, 2014 @ 09:15 PM
Although there is continued effort in the semiconductor packaging industry to reduce package size along with the never-ending pursuit of cost savings, there remain a significant number of applications requiring a wildly different set of capabilities
Posted by Janine Powell on Tue, Dec 17, 2013 @ 03:19 PM
M – Metal-Organic Chemical Vapor Deposition (MOCVD) MOCVD is a process used to grow an epitaxial layer of GaN. Pits often appear during the MOCVD process, correlated with the temperature gradients that result as the wafer bows from center to edge.
Posted by Janine Powell on Wed, Dec 04, 2013 @ 09:25 PM
Towards the beginning of our ABCs of LEDs series, we talked about defects. Here we will tie that in to how defects affect yield of LEDs. K – Kill ratio In looking at a defective wafer through an inspection tool, how do you determine which defects
Posted by Janine Powell on Wed, Nov 20, 2013 @ 09:29 PM
I – Illumination LEDs are bright, efficient, and quick to react. They have become a substitute for light bulbs in many applications because they use less power, have longer lifetimes, produce little heat, and emit colored light. Using LEDs for
Posted by Janine Powell on Wed, Nov 13, 2013 @ 09:16 PM
G – Gallium Nitride (GaN) Last week we talked about epitaxy and film, which ties into our discussion this week about gallium nitride. Gallium nitride is used as an epitaxial layer that is grown on the polished upper surface of the sapphire
Posted by Janine Powell on Wed, Nov 06, 2013 @ 09:25 PM
In this series, we are exploring the ins and outs of LEDs. Last week, we began our LEDs series with “A - Attach process” and “B - Boule”. This week, we continue our journey through the ABCs of LEDs. C – Conductivity In a recent LEDs Magazine
Posted by Janine Powell on Wed, Oct 23, 2013 @ 08:31 PM
SEMICON West 2013 is barely two weeks away; attendees are just days away from over 50 hours of technical programs and focused access to over 600 exhibitors. As in years past, the technical talks have been highly timely and technical.  2013 SEMICON
Posted by Janine Powell on Tue, Jun 25, 2013 @ 03:17 PM
Yole Développement recently met with David Rasmussen, Assembly Services general manager, to discuss automated die bonding tools for today's evolving LED industry. Palomar Technologies has been working with advanced LED designs for over seven years,
Posted by Palomar Technologies MarCom Team on Tue, Jan 15, 2013 @ 03:10 PM