Flip Chip & MEMS Assembly with High-Mix, Automatic Die Sorters
As microelectronics device designs evolve, so must handling and assembly processes. A common example is with the process of removing ...
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As microelectronics device designs evolve, so must handling and assembly processes. A common example is with the process of removing ...
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The search for a "complete, yet customized, solution to a microelectronics assembly requirement" is an all-too-common request from a ...
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Today, the demands for smaller packages require highly reliable thermal coupling to associated packages. Therefore, bondline thickness must ...
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Today's telecommunications/datacom industry is coping with its own technical challenges in processing capabilities through the continuous ...
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With the increased demand for improved functionality and miniaturization in portable hand-held devices—such as cell phones, PDA, digital ...
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Die bonding with eutectic solder processing is becoming more important as thermal challenges increase with the proliferation of laser diode ...
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With the successful deployment of the Pulse Heat Stage (PHS) system from Palomar Technologies, our field sales and engineering teams often ...
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Device thermal management has become more essential as packages run at higher frequencies and higher power levels. Designers are thinning ...
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There is no shortage of good ideas. What is rare, and valuable, is the execution of a good idea. This is most important in the context of ...
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Taking from our last post, we determined that the playing field of contract assembly in complex microelectronics, in regards to cost has ...
Posted by Palomar Technologies MarCom Team on
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