Table Top Wire & Wedge Bonders

Model 626 Multipurpose Digital Thermosonic Bonder—deep-access, long-reach bonder for multi-purpose use for ball, wedge, bump, and peg bonding. Bonds both gold and aluminum wire and ribbon, as well as copper, silver, palladium-silver and up to 1.5 mil platinum wire (application dependent).

Model 676 Digital Thermosonic Wedge Bonder—deep-access, long-reach thermosonic wedge bonder for use with gold wire and gold or aluminum ribbon. In some applications it can be used to bond copper, silver, palladium-silver and up to 1.5 mil platinum wire.

Model 522A Ball Bonder—manual thermosonic ball bonder for use with 0.7 to 2.0 mil gold wire.

Model 522A-40 Deep-Access Ball Bonderdeep-access long-reach thermosonic ball bonder for use with 0.7 to 2.0 mil gold wire.

Model 572A Wedge Bondermanual thermosonic wedge bonder for use with gold wire & gold or aluminum ribbon.

Model 572A-40 Deep-Access Wedge Bonderdeep-access long-reach thermosonic wedge bonder for use with gold wire & gold or aluminum ribbon.

  Semi\u002DAutomated and Manual Wire and Wedge Bonders  

Table Top Die Bonders

Model EDB-141 Epoxy/Silver Glass Die Bondersemi-automatic epoxy/silver glass die bonder featuring selectable and uniform dispense patterns with bond line accuracy of 12.7 microns. It can handle die sizes up to 25mm standard, and can store 200 dispense programs.

Model EDB-140B Epoxy Die Bonder—semi-automatic dispense of epoxy, conductive epoxy or silver glass with a bond line accuracy of 12.7 microns. It can handle die sizes up to 25mm, standard. It can store 200 dispense programs .

Model UDB-141 Eutectic Die Bondersemi-automatic eutectic bonder with standard placement accuracy of 12.5-25 microns (application dependent). It features single footswitch operation for pick-and-place. A turret head allows the machine to pick up preforms and die with separate collets.

Model UDB-206A Eutectic Die Bonderprecise control of ultrasonic scrub energy, force, and time (scrub duration) to provide consistent wetting without damaging die. Ideal for low-to-medium volume and high-reliability production.

HY-Pulse 900A Fluxless /Eutectic Solder Stationstand-alone unit for fluxless soldering applications, or can be used in conjunction with the UDB-140B.

Semi\u002DAutomated and Manual Die Bonders